المؤلفون: Baszynski, M., Chojowski, M., Dziadecki, A., Stobiecki, A., Dudek, R., Skotniczny, J.

المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 70(12):12829-12838 Dec, 2023

المؤلفون: Chojowski, M., Baszynski, M., Dziadecki, A., Dudek, R., Stobiecki, x.

المصدر: IEEE Access Access, IEEE. 11:97726-97734 2023

المؤلفون: Dudek, R., Hildebrandt, M., Kreysig, K., Rzepka, S., Doring, R., Scheiter, L., Zhang, M., Ortmann, R. W.

المصدر: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020 21st International Conference on. :1-8 Jul, 2020

Relation: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Reuther, G.M., Albrecht, J., Pufall, R., Dudek, R., Rzepka, S.

المصدر: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020 21st International Conference on. :1-6 Jul, 2020

Relation: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Dudek, R., Hildebrandt, M., Kreysig, K., Rzepka, S., Doring, R., Seiler, B., Fries, Th., Zhang, M., Ortmann, R. W.

المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :173-179 Dec, 2018

Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Dudek, R., Doring, R., Rzepka, S., Herberholz, T., Feil, D., Seiler, B., Scheiter, L., Schellenberg, C., Fritzsche, S.

المصدر: 2018 7th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2018 7th. :1-6 Sep, 2018

Relation: 2018 7th Electronic System-Integration Technology Conference (ESTC)

المؤلفون: Wunderle, B., May, D., Zschenderlein, U., Ecke, R., Springborn, M., Johrmann, N., Pareek, K. A., Heilmann, J., Stiebing, M., Arnold, J., Dudek, R., Schulz, S., Wolf, M. J., Rzepka, S.

المصدر: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018 19th International Conference on. :1-13 Apr, 2018

Relation: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Dudek, R., Hildebrand, M., Rzepka, S., Beintner, J., Doring, R., Scheiter, L., Seiler, B., Fries, Th., Ortmann, R. W.

المصدر: 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on. :1-9 Apr, 2017

Relation: 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Schaller, R., Strutz, V., Theuss, H., Dudek, R., Rzepka, S.

المصدر: 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on. :1-5 Apr, 2017

Relation: 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Dudek, R., Doring, R., Hildebrandt, M., Rzepka, S., Stegmeier, S., Kiefl, S.

المصدر: 2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-8 Sep, 2016

Relation: 2016 6th Electronic System-Integration Technology Conference (ESTC)