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1مؤتمر
المؤلفون: Dudek, Rainer, Doring, Ralf, Kreysig, Kerstin, Rzepka, Sven, Fruehauf, Peter, Weigert, Andreas
المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-13 Apr, 2024
Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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2مؤتمر
المؤلفون: Dudek, Rainer, Otto, Alexander, Doring, Ralf, Mathew, Anu, Liu, Xing, Rzepka, Sven
المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-11 Apr, 2023
Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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3مؤتمر
المؤلفون: Vandevelde, Bart, Labie, Riet, Lauwaert, Ralph, Dudek, Rainer, Gromala, Przemyslaw, Eichorst, Michael
المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-8 Apr, 2023
Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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4مؤتمر
المؤلفون: Moeller, Heiner, Knoll, Heiko, Hille, Pascal, Dudek, Rainer, Rzepka, Sven
المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :203-209 Sep, 2022
Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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5مؤتمر
المؤلفون: Moller, Heiner, Dudek, Rainer, Otto, Alexander, Rzepka, Sven
المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-8 May, 2022
Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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6مؤتمر
المؤلفون: Vandevelde, Bart, Nawghane, Chinmay, Dudek, Rainer, Doring, Ralf, Schindele, Jens, Gromala, Przemyslaw
المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-7 Apr, 2022
Relation: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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7مؤتمر
المؤلفون: Dudek, Rainer, Doring, Ralf, Mathew, Anu, Otto, Alexander, Rzepka, Sven
المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-11 Apr, 2022
Relation: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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8مؤتمر
المؤلفون: Otto, Alexander, Dudek, Rainer, Kolas, Kshitij, Mathew, Anu, Scherf, Christina, Rzepka, Sven
المصدر: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :670-678 Jun, 2021
Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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9مؤتمر
المؤلفون: Dudek, Rainer, Doring, Ralf, Rzepka, Sven, Gromala, Przemyslaw, Schindele, Jens, Vandevelde, Bart
المصدر: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021 22nd International Conference on. :1-12 Apr, 2021
Relation: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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10مؤتمر
المؤلفون: Mathew, Anu, Dudek, Rainer, Otto, Alexander, Scherf, Christina, Rzepka, Sven, Subbiah, Nilavzhagan, Rane, Kashmira Arvind, Wilde, Jurgen
المصدر: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021 22nd International Conference on. :1-9 Apr, 2021
Relation: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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