يعرض 1 - 7 نتائج من 7 نتيجة بحث عن '"Dulin Wang"', وقت الاستعلام: 0.85s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Deep learning to predict rapid progression of Alzheimer's disease from pooled clinical trials: A retrospective study.

    المؤلفون: Xiaotian Ma, Madison Shyer, Kristofer Harris, Dulin Wang, Yu-Chun Hsu, Christine Farrell, Nathan Goodwin, Sahar Anjum, Avram S Bukhbinder, Sarah Dean, Tanveer Khan, David Hunter, Paul E Schulz, Xiaoqian Jiang, Yejin Kim

    المصدر: PLOS Digital Health, Vol 3, Iss 4, p e0000479 (2024)

    مصطلحات موضوعية: Computer applications to medicine. Medical informatics, R858-859.7

    وصف الملف: electronic resource

    Relation: https://journals.plos.org/digitalhealth/article/file?id=10.1371/journal.pdig.0000479&type=printable; https://doaj.org/toc/2767-3170

    URL الوصول: https://doaj.org/article/d2f144709464433c9f556b2060b689d3

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  2. 2
    دورية أكاديمية
    Non-invasive arterial blood pressure measurement and SpO2 estimation using PPG signal: a deep learning framework

    المؤلفون: Yan Chu, Kaichen Tang, Yu-Chun Hsu, Tongtong Huang, Dulin Wang, Wentao Li, Sean I. Savitz, Xiaoqian Jiang, Shayan Shams

    المصدر: BMC Medical Informatics and Decision Making, Vol 23, Iss 1, Pp 1-16 (2023)

    مصطلحات موضوعية: Deep learning, Blood pressure, Photoplethysmogram, Oxygen saturation, Hypertension assessment, Digital health, Computer applications to medicine. Medical informatics, R858-859.7

    وصف الملف: electronic resource

    Relation: https://doaj.org/toc/1472-6947

    URL الوصول: https://doaj.org/article/870665af64a24e6b8a09e5a347ae6169

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  3. 3
    مؤتمر
    Electromigration failure mechanism investigation between wafer level and plackage level reliability test in AL interconects

    المؤلفون: Dulin, Wang, Nee, Ong Cheng, Seng, Ng Hong

    المصدر: 2016 China Semiconductor Technology International Conference (CSTIC) Semiconductor Technology International Conference (CSTIC), 2016 China. :1-4 Mar, 2016

    Relation: 2016 China Semiconductor Technology International Conference (CSTIC)

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  4. 4
    مؤتمر
    Electromigration failure mechanism comparison between wafer level and package level reliability test on via structure

    المؤلفون: Dulin, Wang, Nee, Ong Cheng, Seng, Ng Hong

    المصدر: 2015 6th Asia Symposium on Quality Electronic Design (ASQED) Quality Electronic Design (ASQED), 2015 6th Asia Symposium on. :86-89 Aug, 2015

    Relation: 2015 6th Asia Symposium on Quality Electronic Design (ASQED)

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  5. 5
    دورية أكاديمية
    Preliminary Study on Forest Fire Prevention and Extinguishing in Townships in the Southern Mountainous Areas of Zhejiang Province: A Case Study of Lishui.

    المؤلفون: Dulin WANG, Ming LUO, Xiaobing YANG, Siwei ZHENG, Jian DENG

    المصدر: Meteorological & Environmental Research; Dec2023, Vol. 14 Issue 6, p53-57, 5p

    مصطلحات موضوعية: FOREST fire prevention & control, WILDFIRE prevention, FOREST fires, FIRE prevention, FIRE risk assessment, FIREFIGHTING, INTERNET usage monitoring

    مصطلحات جغرافية: ZHEJIANG Sheng (China)

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  6. 6
    مؤتمر
    Mechanism exploration on Cu interconnect negative resistance shift during stress migration

    المؤلفون: XiangFu Zhao, Dulin Wang, Gan, Howard, Zheng, Kevin, Wu, Jeff, Venson Chang, Wei-Ting Kary Chien

    المصدر: 2014 IEEE International Reliability Physics Symposium Reliability Physics Symposium, 2014 IEEE International. :IT.1.1-IT.1.3 Jun, 2014

    Relation: 2014 IEEE International Reliability Physics Symposium (IRPS)

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  7. 7
    Mechanism exploration on Cu interconnect negative resistance shift during stress migration

    المؤلفون: Venson Chang, Kevin Zheng, Howard Gan, Jeff Wu, Dulin Wang, XiangFu Zhao, Wei-Ting Kary Chien

    المصدر: 2014 IEEE International Reliability Physics Symposium.

    مصطلحات موضوعية: Barrier layer, Interconnection, Negative shift, Materials science, chemistry, Negative resistance, Stress migration, Trench, Metallurgy, chemistry.chemical_element, Composite material, Copper

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c40182c58de1f00cae5ad764c8560e1f
    https://doi.org/10.1109/irps.2014.6861150

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