المؤلفون: Liu, Fuhan, Zhang, Rui, DeProspo, Bartlet H., Dwarakanath, Shreya, Nimbalkar, Pratik, Ravichandran, Siddharth, Weyers, David, Kathaperumal, Mohanalingam, Tummala, Rao R., Swaminathan, Madhavan

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1132-1139 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Tummala, Rao, Deprospo, Bartlet, Dwarakanath, Shreya, Ravichandran, Siddharth, Nimbalkar, Pratik, Nedumthakady, Nithin, Swaminathan, Madhavan

المصدر: 2020 Pan Pacific Microelectronics Symposium (Pan Pacific) Pan Pacific Microelectronics Symposium (Pan Pacific), 2020. :1-5 Feb, 2020

Relation: 2020 Pan Pacific Microelectronics Symposium (Pan Pacific)

المؤلفون: Dwarakanath, Shreya, Raj, P. Markondeya, Agarwal, Amit, Okamoto, Daichi, Kubo, Atsushi, Liu, Fuhan, Kathaperumal, Mohan, R. Tummala, Rao

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :718-725 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

المؤلفون: Raj, Pulugurtha Markondeya, Spurnevy, Robert Grant, Dwarakanath, Shreya, Mohanalingam, Kathaperumal, Tummala, Rao

المصدر: 2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC) Nanotechnology Materials and Devices Conference (NMDC), 2018 IEEE 13th. :1-5 Oct, 2018

Relation: 2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC)

المؤلفون: Dwarakanath, Shreya, Raj, P. Markondeya, Smet, Vanessa, Sundaram, Venky, Losego, Mark D, Tummala, Rao

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :179-184 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

المؤلفون: Dwarakanath, Shreya, Raj, Pulugurtha Markondeya, Leng, Collen Z., Smet, Vanessa, Losego, Mark D., Sundaram, Venky, Tummala, Rao

المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :150-155 May, 2017

Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

المؤلفون: Liu, Fuhan, Kubo, Atsushi, Nair, Chandrasekharan, Ando, Tomoyuki, Furuya, Ryuta, Dwarakanath, Shreya, Sundaram, Venky, Tummala, Rao R.

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :1515-1521 May, 2016

Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

المؤلفون: Dwarakanath, Shreya, Kakutani, Takenori, Okamoto, Daichi, Raj, Pulugurtha Markondeya, Swaminathan, Madhavan, Tummala, Rao R.

المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology; Sep2020, Vol. 10 Issue 9, p1552-1559, 8p

مصطلحات موضوعية: FATIGUE life, DIELECTRIC materials, ELECTRIC wiring, MECHANICAL properties of condensed matter, DIELECTRIC properties, DOWNSCALING (Climatology)