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المؤلفون: Chi-Chuan Wang, F. Ramberg, H. Rhodes, Jen-Cheng Liu, Calvin Yi-Ping Chao, Dyson H. Tai, Vincent Venezia, Shou-Gwo Wuu, Candace Su-Jung Tsai, Dun-Nian Yaung, Wen-De Wang, C.C. Chuang, W.P. Mo, Tzu-Hsuan Hsu, B.C. Hsieh, Ta-Wei Wang, Yeur-Luen Tu
المصدر: 2011 International Electron Devices Meeting.
مصطلحات موضوعية: Wafer-scale integration, Materials science, Silicon, Pixel, Annealing (metallurgy), business.industry, chemistry.chemical_element, Hardware_PERFORMANCEANDRELIABILITY, Dielectric, chemistry, Hardware_INTEGRATEDCIRCUITS, Back-illuminated sensor, Optoelectronics, Wafer, Image sensor, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::98827d6af2d9b7933d614557b70b11c0
https://doi.org/10.1109/iedm.2011.6131512