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1مؤتمر
المؤلفون: Edelstein, D., Rathore, H., Davis, C., Clevenger, L., Cowley, A., Nogami, T., Agarwala, B., Arai, S., Carbone, A., Chanda, K., Chen, F., Cohen, S., Cote, W., Cullinan, M., Dalton, T., Das, S., Davis, P., Demarest, J., Dunn, D., Dziobkowski, C., Filippi, R., Fitzsimmons, J., Flaitz, P., Gates, S., Gill, J., Grill, A., Hawken, D., Ida, K., Klaus, D., Klymko, N., Lane, M., Lane, S., Lee, J., Landers, W., Li, W.-K., Lin, Y.-H., Liniger, E., Liu, X.-H., Madan, A., Malhotra, S., Martin, J., Molis, S., Muzzy, C., Nguyen, D., Nguyen, S., Ono, M., Parks, C., Questad, D., Restaino, D., Sakamoto, A., Shaw, T., Shimooka, Y., Simon, A., Simonyi, E., Swift, A., Van Kleeck, T., Vogt, S., Wang, Y.-Y., Wille, W., Wright, J., Yang, C.-C., Yoon, M., Ivers, T.
المصدر: 2004 IEEE International Reliability Physics Symposium. Proceedings Reliability physics Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International. :316-319 2004
Relation: 2004 IEEE International Reliability Physics Symposium. Proceedings
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2مؤتمر
المؤلفون: Dalton, T.J., Fuller, N., Tweedie, C., Dunn, D., Labelle, C., Gates, S., Colburn, M., Chen, S.T., Lai, T., Dellaguardia, R., Petrarca, K., Dziobkowski, C., Kumar, K., Siddiqui, S.
المصدر: Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Interconnect technology Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International. :154-156 2004
Relation: Proceedings of the IEEE 2004 International Interconnect Technology Conference
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3مؤتمر
المؤلفون: Edelstein, D., Davis, C., Clevenger, L., Yoon, M., Cowley, A., Nogami, T., Rathore, H., Agarwala, B., Arai, S., Carbone, A., Chanda, K., Cohen, S., Cote, W., Cullinan, M., Dalton, T., Das, S., Davis, P., Demarest, J., Dunn, D., Dziobkowski, C., Filippi, R., Fitzsimmons, J., Flaitz, P., Gates, S., Gill, J., Grill, A., Hawken, D., Ida, K., Klaus, D., Klymko, N., Lane, M., Lane, S., Lee, J., Landers, W., Li, W.-K., Lin, Y.-H., Liniger, E., Liu, X.-H., Madan, A., Malhotra, S., Martin, J., Molis, S., Muzzy, C., Nguyen, D., Nguyen, S., Ono, M., Parks, C., Questad, D., Restaino, D., Sakamoto, A., Shaw, T., Shimooka, Y., Simon, A., Simonyi, E., Tempest, S., Van Kleeck, T., Vogt, S., Wang, Y.-Y., Wille, W., Wright, J., Yang, C.-C., Ivers, T.
المصدر: Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Interconnect technology Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International. :214-216 2004
Relation: Proceedings of the IEEE 2004 International Interconnect Technology Conference
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4مؤتمر
المؤلفون: Gambino, J., Clevenger, L., Costrini, G., Schnabel, F., Ravikumar, R., Dobuzinsky, D., Iggulden, R., Dziobkowski, C., Wildman, H., Benedict, J., Bruley, J., Domenicucci, A.
المصدر: Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) Interconnect technology Interconnect Technology, 1999. IEEE International Conference. :206-208 1999
Relation: Proceedings of the IEEE 1999 International Interconnect Technology Conference
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5دورية أكاديمية
المؤلفون: Liniger, E.G., Dziobkowski, C.
المصدر: In Thin Solid Films 2006 513(1):295-299
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6دورية أكاديمية
المؤلفون: Gluschenkov, O., Benedict, J., Clevenger, L. A., DeHaven, P., Dziobkowski, C., Faltermeier, J., Lin, C., McStay, I., Wong, K.
المصدر: MRS Online Proceedings Library. 611(1)
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7مؤتمر
المؤلفون: Nogami, T., Lane, S., Fukasawa, M., Ida, K., Angyal, M., Chanda, K., Chen, F., Christiansen, C., Cohen, S., Cullinan, M., Dziobkowski, C., Fitzsimmons, J., Flaitz, P., Grill, A., Gill, J., Inoue, K., Klymko, N., Kumar, K., Labelle, C., Lane, M.
المصدر: Proceedings of SPIE; Nov2005 Part 2, Issue 1, p60020L-60020L-15, 15p
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8مؤتمر
المؤلفون: Gluschenkov, O., Benedict, J., Clevenger, L. A., DeHaven, P., Dziobkowski, C., Faltermeier, J., Lin, C., McStay, I., Wong, K.
المصدر: MRS Online Proceedings Library; 2000, Vol. 611 Issue 1, p1-6, 6p
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9دورية أكاديمية
المؤلفون: Milkove, K. R., Coffin, J. A., Dziobkowski, C.
المصدر: Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; 1998, Vol. 16 Issue 3, p1483-1488, 6p
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10مؤتمر
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