المؤلفون: Piotr Putek, Rick Janssen, Jan Niehof, E. Jan W. ter Maten, Roland Pulch, Bratislav Tasić, Michael Günther

المصدر: Journal of Mathematics in Industry, Vol 8, Iss 1, Pp 1-19 (2018)

مصطلحات موضوعية: Floor-plan modeling, Isolation grounding, Polynomial chaos expansion, Stochastic collocation method, Uncertainty quantification, Robust design optimization, Mathematics, QA1-939, Industry, HD2321-4730.9

وصف الملف: electronic resource

Relation: http://link.springer.com/article/10.1186/s13362-018-0054-3; https://doaj.org/toc/2190-5983

URL الوصول: https://doaj.org/article/645c0a5939c94168bc28dd1c20ed615b

المؤلفون: Mirza, Fahad, Khor, E E Jan, Lee, Fook Hong, Premachandran, C S, Yi, Wanbing, Tan, Juan Boon, Graas, Carole, Justison, Patrick

المصدر: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2016 IEEE 23rd International Symposium on the. :350-355 Jul, 2016

Relation: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Putek, Piotr, Meuris, Peter, Pulch, Roland, ter Maten, E. Jan W., Gunther, Michael, Schoenmaker, Wim, Deleu, Frederik, Wieers, Aarnout

المصدر: 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE) Design, Automation & Test in Europe Conference & Exhibition (DATE), 2016. :319-324 Mar, 2016

Relation: 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)

المؤلفون: Tasic, Bratislav, Dohmen, Jos J., Janssen, Rick, ter Maten, E. Jan W., Beelen, Theo G.J., Pulch, Roland

المصدر: 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE) Design, Automation & Test in Europe Conference & Exhibition (DATE), 2016. :301-306 Mar, 2016

Relation: 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)

المؤلفون: Vardaman, E. Jan

المصدر: 2017 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2017 International Conference on. :318-320 Apr, 2017

Relation: 2017 International Conference on Electronics Packaging (ICEP)

المؤلفون: Palesko, Chet, Palesko, Amy, Vardaman, E. Jan

المصدر: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2014. :1-5 Sep, 2014

Relation: 2014 Electronics System-Integration Technology Conference (ESTC)

المؤلفون: Putek, Piotr A., ter Maten, E. Jan. W., Günther, Michael, Sykulski, Jan K.

مصطلحات موضوعية: Physics - Applied Physics, 65K10, 90C29, 49M37, 35R60

URL الوصول: http://arxiv.org/abs/1709.02609

المؤلفون: Palesko, Chet A., Vardaman, E. Jan, Palesko, Alan C.

المصدر: 2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :1970-1975 May, 2012

Relation: 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Janssen, Rick^Aff17, Gillon, Renaud^Aff18, Wieers, Aarnout^Aff18, Deleu, Frederik^Aff18, Guegnaud, Hervé^Aff19, Reynier, Pascal^Aff19, Schoenmaker, Wim^Aff20, ter Maten, E. Jan W.^Aff21

المساهمون: Bock, Hans Georg, Series Editor^Aff1, de Hoog, Frank, Series Editor^Aff2, Friedman, Avner, Series Editor^Aff3, Gupta, Arvind, Series Editor^Aff4, Nachbin, André, Series Editor^Aff5, Ozawa, Tohru, Series Editor^Aff6, Pulleyblank, William R., Series Editor^Aff7, Rusten, Torgeir, Series Editor^Aff8, Santosa, Fadil, Series Editor^Aff9, Seo, Jin Keun, Series Editor^Aff10, Tornberg, Anna-Karin, Series Editor^Aff11, ter Maten, E. Jan W., editor^Aff12, Brachtendorf, Hans-Georg, editor^Aff13, Pulch, Roland, editor^Aff14, Schoenmaker, Wim, editor^Aff15, De Gersem, Herbert, editor^Aff16

المصدر: Nanoelectronic Coupled Problems Solutions. 29:517-563

المؤلفون: Gillon, Renaud^Aff17, Wieers, Aarnout^Aff17, Deleu, Frederik^Aff17, Gotthans, Tomas^Aff18, Janssen, Rick^Aff19, Schoenmaker, Wim^Aff20, ter Maten, E. Jan W.^Aff21

المساهمون: Bock, Hans Georg, Series Editor^Aff1, de Hoog, Frank, Series Editor^Aff2, Friedman, Avner, Series Editor^Aff3, Gupta, Arvind, Series Editor^Aff4, Nachbin, André, Series Editor^Aff5, Ozawa, Tohru, Series Editor^Aff6, Pulleyblank, William R., Series Editor^Aff7, Rusten, Torgeir, Series Editor^Aff8, Santosa, Fadil, Series Editor^Aff9, Seo, Jin Keun, Series Editor^Aff10, Tornberg, Anna-Karin, Series Editor^Aff11, ter Maten, E. Jan W., editor^Aff12, Brachtendorf, Hans-Georg, editor^Aff13, Pulch, Roland, editor^Aff14, Schoenmaker, Wim, editor^Aff15, De Gersem, Herbert, editor^Aff16

المصدر: Nanoelectronic Coupled Problems Solutions. 29:425-455