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1مؤتمر
المؤلفون: Hofmann, A., Lomakin, K., Kleinlein, M., Bader, T., Sippel, M., Gold, G.
المصدر: 2023 53rd European Microwave Conference (EuMC) Microwave Conference (EuMC), 2023 53rd European. :243-246 Sep, 2023
Relation: 2023 53rd European Microwave Conference (EuMC)
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2مؤتمرLarge-Scale Cu Interconnection of Organic Substrate Materials Through Electroless Plating Technology
المؤلفون: Shih, M. L., Shih, P. S., Huang, J. H., Chen, I. A., Wang, J. S., Ko, C. T., Lin, B. R., Yang, K. M., Lin, C. H., Lee, A. S., Kao, C. R.
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :1-2 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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3مؤتمر
المؤلفون: Chen, Hung-Kun, Chan, Shun-Jen, Pai, Yu-Cheng, Chen, Carl, Wang, Yu-Po
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :141-142 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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4مؤتمر
المؤلفون: Lin, Yung-Sheng, Chiang, Chun-Wei, Hung, Yun-Ching, Kao, Chin-Li, Hsieh, Ping-Hung, Hsu, Chih-Yuan, Lin, I-Ting
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1115-1118 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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5مؤتمر
المؤلفون: Shih, Po-Shao, Huang, Jeng-Hau, Shen, Chang-Hsien, Lin, Yu-Chun, Grufner, Simon Johannes, Renganathan, Vengudusamy, Kao, Chin-Li, Lin, Yung-Sheng, Hung, Yun-Ching, Chiang, Chun-Wei, Kao, C. Robert
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :579-584 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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6دورية أكاديمية
المؤلفون: Chen, YangAff1, Aff2, Shao, Xiao-MingAff1, Aff2, He, LiangAff1, Aff2, Xu, Yi-Nuo, Yao, Qi-YuanAff1, Aff2, Feng, DingAff1, Aff2, Wang, Wen-CaiAff1, Aff2, IDs1011802431086_cor7
المصدر: Chinese Journal of Polymer Science. 42(6):864-873
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7دورية أكاديمية
المؤلفون: Saraloğlu Güler, EbruAff1, IDs12666024032609_cor1, Irgin, Dilara
المصدر: Transactions of the Indian Institute of Metals. 77(6):1553-1562
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8دورية أكاديمية
المؤلفون: Sakai, TomokiAff1, Aff4, Tabata, Isao, Hori, Teruo, Hirogaki, KazumasaAff1, IDs12221024005325_cor4
المصدر: Fibers and Polymers. 25(5):1737-1750
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9مؤتمر
المؤلفون: Hofmann, A., Klein, L., Lomakin, K., Sippel, M., Gold, G.
المصدر: 2022 52nd European Microwave Conference (EuMC) Microwave Conference (EuMC), 2022 52nd European. :373-376 Sep, 2022
Relation: 2022 52nd European Microwave Conference (EuMC)
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10مؤتمر
المؤلفون: Georgieva, Mihaela G.
المصدر: 2022 XXXI International Scientific Conference Electronics (ET) Scientific Conference Electronics (ET), 2022 XXXI International. :1-4 Sep, 2022
Relation: 2022 XXXI International Scientific Conference Electronics (ET)