المؤلفون: Prasanna Prasad, S., Jois, C., Singh, Y., Subbarayan, G., Penmecha, B., Raghavan, P.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(7):1308-1318 Jul, 2024

المؤلفون: Tulzo, Harold Le, Bijou, Diane, Souza, Therese, Gallegos, Anthony, Thomas, Candice, Deschaseaux, Edouard, Feautrier, Celine, Charbonnier, Jean, Gueugnot, Alain, Derakhshandeh, Jaber, Hussain, Tassawar, Daviot, Jerome

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :378-385 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Maubert, Marie, Gottardi, Mathilde, Philip, Pierre-Emile, Fragnaud, Emilie, Romero, Gilles, Cornelis, Arnaud, Hijazi, Hadi, Fournel, Frank, Calvo-Munoz, Maria-Luisa

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :631-636 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Tucek, Radek, Vojtech, Lukas

المصدر: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-5 May, 2024

Relation: 2024 47th International Spring Seminar on Electronics Technology (ISSE)

المؤلفون: Johnson, Noah, Jensen, Dillon, Horspool, Alexander, Nielson, Gregory N., Schultz, Stephen M.

المصدر: 2024 Intermountain Engineering, Technology and Computing (IETC) Intermountain Engineering, Technology and Computing (IETC), 2024. :113-117 May, 2024

Relation: 2024 Intermountain Engineering, Technology and Computing (IETC)

المؤلفون: Lin, Y., Kwon, H., Chen, H., Gupta, M.P., Degner, M., Asheghi, M., Mantooth, H.A., Goodson, K.E.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(5):810-823 May, 2024

المؤلفون: Xu, Yingming, Zhou, Peng, Simon, Terrence, Cui, Tianhong

المصدر: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2024 IEEE 37th International Conference on. :887-890 Jan, 2024

Relation: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Van Nhat Anh, Tran, Venkataraman, Nandini, Tao, Meng, Ya-Ching, Tseng, Xiangyu, Wang, King-Jien, Chui, Singh, Navab, Rao, Vempati Srinivasa

المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :1059-1062 Dec, 2023

Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Lv, Weishan, Lei, Xin, Liu, Jiaxin, Zhu, Fulong

المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :1086-1089 Dec, 2023

Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Wang, Manfei, Xu, Jinkai, Ren, Wanfei

المصدر: 2023 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 2023 IEEE International Conference on. :205-208 Jul, 2023

Relation: 2023 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)