يعرض 1 - 10 نتائج من 880 نتيجة بحث عن '"Electrochemical migration"', وقت الاستعلام: 0.86s تنقيح النتائج
  1. 1
    مؤتمر
    Root Cause Analysis of Intermittent Digital System Reset and Its Reliability Evaluation

    المؤلفون: Tan, Cher Ming, Wang, Steve, Huang, Shawn LH, Xiong, Josh MP, Luo, Henry YH, Pandey, Vimal Kant

    المصدر: 2024 Annual Reliability and Maintainability Symposium (RAMS) Reliability and Maintainability Symposium (RAMS), 2024 Annual. :1-6 Jan, 2024

    Relation: 2024 Annual Reliability and Maintainability Symposium (RAMS)

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  2. 2
    مؤتمر
    Probability of Failure due to Electrochemical Migration on Surface Mount Capacitor under Electrolyte Condition with same Contamination and Conductivity Level

    المؤلفون: Bahrebar, Sajjad, Ambat, Rajan

    المصدر: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Microelectronics Packaging (NordPac), 2023 IMAPS Nordic Conference on. :1-9 Jun, 2023

    Relation: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

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  3. 3
    مؤتمر
    Effect of Incorporation of Ceramic Nanoparticles in Bismuth-Tin Solder Paste on Electrochemical Migration

    المؤلفون: Vesely, Petr, Fros, Denis, Klimtova, Marketa, Gharaibeh, Ali, Medgyes, Balint

    المصدر: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-6 May, 2023

    Relation: 2023 46th International Spring Seminar on Electronics Technology (ISSE)

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  4. 4
    مؤتمر
    Evaluation of Dendrite Growth between Electrodes with Different Shapes and Voltage Polarity

    المؤلفون: Klimtova, Marketa, Kralova, Iva

    المصدر: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-5 May, 2023

    Relation: 2023 46th International Spring Seminar on Electronics Technology (ISSE)

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  5. 5
    مؤتمر
    Effect of TiO2 Nanoparticles Addition on the Electrochemical Migration of Low-Silver Lead-Free SAC Alloys

    المؤلفون: Gharaibeh, Ali, Rigler, Daniel, Medgyes, Balint

    المصدر: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-5 May, 2023

    Relation: 2023 46th International Spring Seminar on Electronics Technology (ISSE)

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  6. 6
    دورية أكاديمية
    Aqueous Conductive Polymer Composites with Good Printability and Conductivity for Flexible Electronics

    المؤلفون: Lu, YunfeiAff1, Aff2, Wang, YuxinAff1, Aff2, Qi, XueAff1, Aff2, Lv, HaoAff1, Aff2, Yin, AoAff1, Aff2, Liu, HaipengAff1, Aff2, Yu, SuzhuAff1, Aff2, IDs1166402411024w_cor7, Zhao, WeiweiAff1, Aff2, IDs1166402411024w_cor8, Wei, JunAff1, Aff2, Aff3, IDs1166402411024w_cor9

    المصدر: Journal of Electronic Materials. 53(6):3143-3153

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  7. 7
    دورية أكاديمية
    Combined Effects of Polluted Particles and Environmental Factors on Electrochemical Migration Failure

    المؤلفون: Zhou, Y., Wei, L., Zhao, Y., Lu, W., Li, Y.

    المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 23(1):27-36 Mar, 2023

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  8. 8
    مؤتمر
    Electrochemical migration investigation on SAC alloys incorporated by TiO2 nanoparticles in NaCl solution

    المؤلفون: Gharaibeh, Ali, Medgyes, Balint

    المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :484-487 Sep, 2022

    Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

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  9. 9
    مؤتمر
    Failures of Ag Wire Bonding ICs in Real-world Applications

    المؤلفون: Chen, Xuanlong, Xie, Xiaping, Wang, Min, Ruan, Yongjia, Liu, Tianhan, Shi, Lin

    المصدر: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-4 Jul, 2022

    Relation: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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  10. 10
    دورية أكاديمية
    Electrochemical migration behavior between Cu and Ag under a thin electrolyte layer containing chloride

    المؤلفون: Luo, Lu, Qi, Kang, Huang, Hualiang

    المصدر: Anti-Corrosion Methods and Materials, 2024, Vol. 71, Issue 2, pp. 204-212.

    URL الوصول: http://www.emeraldinsight.com/doi/10.1108/ACMM-11-2023-2924

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