المؤلفون: Yang, P., Huang, J., Chang, Y., Chan, C., Chen, W.

المصدر: IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 12:74-82 2024

المؤلفون: Wang, Z., Gao, J., Wang, W., Bilal, H.M., Wu, Y., Wang, C.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 22(1):65-72 Mar, 2022

المؤلفون: Po-Hui Yang, Jyun-Ming Huang, Ying-Sheng Chang, Che-Tsung Chan, Wei-Shun Chen

المصدر: IEEE Journal of the Electron Devices Society, Vol 12, Pp 74-82 (2024)

مصطلحات موضوعية: Magnesium oxide (MgO), pH sensor, flexible printed circuit board (FPCB), electroless nickel immersion gold (ENIG) electrode, instrumentation amplifier (INA), Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/10382168/; https://doaj.org/toc/2168-6734

URL الوصول: https://doaj.org/article/e196f128be5c446ab83e2d59fd5568d1

المؤلفون: Ono, Satoshi, Wada, Koji

المصدر: 2018 Asia-Pacific Microwave Conference (APMC) Microwave Conference (APMC), 2018 Asia-Pacific. :1363-1365 Nov, 2018

Relation: 2018 Asia-Pacific Microwave Conference (APMC)

المؤلفون: Hyeon-Tae Kim, Jeong-Won Yoon

المصدر: Journal of Materials Research and Technology, Vol 24, Iss , Pp 4468-4483 (2023)

مصطلحات موضوعية: Ultrasonic bonding, Electroless nickel-immersion gold, Sn-3.5Ag solder, Shear strength, Intermetallic compound, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423007913; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/9e4a20807bc146b7a8175a493b37913f

المؤلفون: Ong, Cheng-Guan, Lau, Kok-Tee, Zaimi, Muhammad, Afiq, Muhammad, Queck, Kian-Pin

المصدر: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016 11th International. :319-322 Oct, 2016

Relation: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Razizy, F. Muhamad^Aff10, Zhang, N. Zhen^Aff10, Hashim, M. S.^Aff10, Azlina, O. Saliza^Aff10, Azmir, O. Shahrul^Aff10

المساهمون: Bergmann, Carlos P., Series Editor^Aff1, Frade, Jorge R, Editorial Board Member^Aff2, Carda Castelló, Juan Bautista, Editorial Board Member^Aff3, Bolmaro, Raul, Editorial Board Member^Aff4, Esposito, Vincenzo, Editorial Board Member^Aff5, Salleh, Mohd Arif Anuar Mohd, editor^Aff6, Abdul Aziz, Mohd Sharizal, editor^Aff7, Jalar, Azman, editor^Aff8, Izwan Ramli, Mohd Izrul, editor^Aff9

المصدر: Recent Progress in Lead-Free Solder Technology : Materials Development, Processing and Performances. :171-194

المؤلفون: Zhonghua, Wan, Yabing, Zou, Guanghui, He, Daojun, Luo

المصدر: 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :814-817 Aug, 2013

Relation: 2013 14th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Fan, Yaohui, Wu, Yifan, Dale, Travis F., Lakshminarayana, Sukshitha Achar Puttur, Greene, Colin V., Badwe, Nilesh U.^{Aff3, Aff4}, Aspandiar, Raiyo F., Blendell, John E., Subbarayan, Ganesh, Handwerker, Carol A.^Aff1

المصدر: Journal of Electronic Materials. 50(12):6615-6628

المؤلفون: Yu, A., Kumar, A., Ho, S. W., Yin, H. W., Lau, J. H., Su, N., Houe, K. C., Ching, J. M., Kripesh, V., Chen, S., Chan, C.-F., Chao, C.-C., Chiu, C.-H., Chan, C.-Y., Chang, C.-H., Huang, C.-M., Chen, C.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(11):1777-1785 Nov, 2012