-
1دورية أكاديمية
المؤلفون: Kovács, J.Aff1, IDs40194024017148_cor1, Gáspár, M., Lukács, J., Tervo, H., Kaijalainen, A.
المصدر: Welding in the World: The International Journal of Materials Joining. 68(8):1965-1980
-
2دورية أكاديمية
المؤلفون: Sparks, GregoryAff1, Aff2, Aff3, IDs40192024003706_cor1, Mason, Simon A., Chapman, Michael G.Aff1, Aff4, Park, Jun-Sang, Sharma, Hemant, Kenesei, Peter, Niezgoda, Stephen R.Aff2, Aff6, Mills, Michael J., Uchic, Michael D., Shade, Paul A., Obstalecki, Mark
المصدر: Integrating Materials and Manufacturing Innovation: Tools, Methods, and Impact of Digitally Enabled Materials Engineering. :1-31
-
3دورية أكاديمية
المؤلفون: Klünsner, ThomasAff1, IDs00501024014557_cor1, Ressel, Gerald, Angerer, Paul, Brandl, Dominik, Bauer, Nicolas, Kosednar-Legenstein, Barbara, Sartory, Bernhard, Hönigmann, Thomas, Pogrielz, ThomasAff1, Aff2, Keckes, Jozef
المصدر: BHM Berg- und Hüttenmännische Monatshefte. 169(5):247-251
-
4دورية أكاديمية
المؤلفون: Kumar, Parveen, Sharma, Satish KumarAff1, IDs4043602300457x_cor2, Raj Singh, Ratnesh Kumar
المصدر: Advances in Manufacturing. 12(1):124-149
-
5دورية أكاديمية
المؤلفون: Yu-Hsun Chang, Yu-Ming Lin, Cheng-Yu Lee, Pei-Chia Hsu, Chih-Ming Chen, Cheng-En Ho
المصدر: Journal of Materials Research and Technology, Vol 31, Iss , Pp 1008-1016 (2024)
مصطلحات موضوعية: Through glass via (TGV), Finite element analysis (FEA), Electron backscatter diffraction (EBSD), Throwing power (TP), Electroplated Cu, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
-
6مؤتمر
المؤلفون: Young, Kendra, Aspandiar, Raiyo, Badwe, Nilesh, Walwadkar, Satyajit, Lee, Young-Woo, Lee, Tae-Kyu
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1199-1205 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
-
7دورية أكاديمية
المؤلفون: ChenChun Chiu, Faisal Qayyum, Susanne Berndorf, ShaoChen Tseng, Sergey Guk, ChingKong Chao, Ulrich Prahl
المصدر: Journal of Materials Research and Technology, Vol 32, Iss , Pp 2030-2051 (2024)
مصطلحات موضوعية: TRIP steel, Metal matrix composite (MMC), In situ SEM tensile test, Digital image correlation (DIC), DAMASK, Electron backscatter diffraction (EBSD), Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
-
8كتاب إلكتروني
المؤلفون: Yi, HaoranAff6, Zeng, XunAff6, Guan, DikaiAff6
المساهمون: Leonard, Aeriel, editorAff1, Barela, Steven, editorAff2, Neelameggham, Neale R., editorAff3, Miller, Victoria M., editorAff4, Tolnai, Domonkos, editorAff5
المصدر: Magnesium Technology 2024. :49-53
-
9دورية أكاديمية
المؤلفون: Shao-Pu Tsai, Ming-Tai Hong, Wei-Hsun Lin, Ssu-Yun Lu, Yun-Rong Jiang, Te-Wei Lin, Po-Yen Tung
المصدر: Journal of Materials Research and Technology, Vol 30, Iss , Pp 7644-7654 (2024)
مصطلحات موضوعية: Low-carbon containing duplex stainless steel, Hot ductility, Gleeble 3500, Electron backscatter diffraction (EBSD), Dynamic recrystallization (DRX), Dynamic recovery (DRV), Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
-
10دورية أكاديمية
المؤلفون: Seoah Kim, YehRi Kim, Eunjin Jo, Hyeon-Sung Lee, Sungwook Mhin, Tae-Young Lee, Sehoon Yoo, Yong-Ho Ko, Dongjin Kim
المصدر: Journal of Materials Research and Technology, Vol 30, Iss , Pp 6668-6685 (2024)
مصطلحات موضوعية: Laser soldering, Aluminum flexible printed circuit board, Electron backscatter diffraction (EBSD), Numerical simulation, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource