يعرض 1 - 10 نتائج من 49 نتيجة بحث عن '"Electronic apparatus and appliances Materials."', وقت الاستعلام: 1.49s تنقيح النتائج
  1. 1
  2. 2
  3. 3
    كتاب

    المساهمون: Capolino, Filippo.

  4. 4
  5. 5
  6. 6
    كتاب

    المساهمون: Harper, Charles A., Cohn, Charles., Schoch, Karl F., Bailey, Alan E., Gardner, J. Donald., Hwang, Jennie S., McChesney, Mike., Carano, Michael., Fjelstad, Joseph., Sergent, Jerry E., Toleno, Brian J., Burns, Barry., Marinelli, Christy., Krum, Al.

    Other Title: Development and fabrication of IC chips.
    Plastics, elastomers, and composites.
    Ceramics and glasses.
    Metals.
    Solder technologies for electronic packaging and assembly.
    Electroplating and deposited metallic coatings.
    Printed circuit board fabrication.
    Materials and processes for hybrid microelectronics and multichip modules.
    Adhesives, underfills, and coatings in electonics assemblies.
    Thermal management materials and systems.

  7. 7
    كتاب

    المساهمون: Lau, John H.

    وصف الملف: text

    Other Title: Introduction to environmentally benign electronics manufacturing.
    Chip- (wafer- ) level interconnects with lead-free solder bumps.
    WLCSP with lead-free solder bumps on PCB/substrate.
    Chip- (wafer- ) level interconnects with solderless bumps.
    WLCSPs with solderless bumps on PCB/substate.
    Environmentally benign molding compounds for IC packages.
    Environmentally benign die attach films for IC packaging.
    Environmental issues for conventional PCBs.
    Halogenated and halogen-free materials for flame retardation.
    Fabrication of environmentally friendly PCB.
    Global status of lead-free soldering.
    Development of lead-free solder alloys.
    Prevailing lead-free alloys.
    Lead-free surface finishes.
    Implementation of lead-free soldering.
    Challenges for lead-free soldering.
    Introduction to conducive adhesives.
    Conductivity establishment of conductive adhesives.
    Mechanisms underlying the unstable contact resistance of ECAs.
    Stabilization of contact resistance of conductive adhesives.

    Relation: Electronic reproduction. New York, N.Y. : McGraw Hill, 2003. Mode of access: World Wide Web. System requirements: Web browser. Access may be restricted to users at subscribing institutions.

  8. 8
  9. 9
  10. 10