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3كتاب
المساهمون: Capolino, Filippo.
مصطلحات موضوعية: Electronic apparatus and appliances -- Materials., Metamaterials.
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4كتاب إلكتروني
المؤلفون: Ahmed Thabet Mohamed
نوع المادة: eBook.
الموضوعات: Nanostructured materials, Nanoelectronics, Electronic apparatus and appliances--Materials, Electric apparatus and appliances--Materials
تصنيفات: TECHNOLOGY & ENGINEERING / Nanotechnology & MEMS, TECHNOLOGY & ENGINEERING / General, TECHNOLOGY & ENGINEERING / Electrical
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5دورية
المساهمون: Electrochemical Society., Institute of Electrical and Electronics Engineers.
المصدر: Chemical abstracts, 0009-2258.
مصطلحات موضوعية: Electronic apparatus and appliances -- Materials -- Periodicals., Solid state electronics -- Periodicals., Electrochemistry -- Periodicals., Électronique de l'état solide -- Périodiques., Électronique -- Périodiques., Électrochimie -- Périodiques., Vastestoffysica., Elektrochemie., Electrochemistry., Electronic apparatus and appliances -- Materials., Solid state electronics., Periodicals.
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6كتاب
المساهمون: Harper, Charles A., Cohn, Charles., Schoch, Karl F., Bailey, Alan E., Gardner, J. Donald., Hwang, Jennie S., McChesney, Mike., Carano, Michael., Fjelstad, Joseph., Sergent, Jerry E., Toleno, Brian J., Burns, Barry., Marinelli, Christy., Krum, Al.
Other Title: Development and fabrication of IC chips.
Plastics, elastomers, and composites.
Ceramics and glasses.
Metals.
Solder technologies for electronic packaging and assembly.
Electroplating and deposited metallic coatings.
Printed circuit board fabrication.
Materials and processes for hybrid microelectronics and multichip modules.
Adhesives, underfills, and coatings in electonics assemblies.
Thermal management materials and systems. -
7كتاب
المساهمون: Lau, John H.
وصف الملف: text
Other Title: Introduction to environmentally benign electronics manufacturing.
Chip- (wafer- ) level interconnects with lead-free solder bumps.
WLCSP with lead-free solder bumps on PCB/substrate.
Chip- (wafer- ) level interconnects with solderless bumps.
WLCSPs with solderless bumps on PCB/substate.
Environmentally benign molding compounds for IC packages.
Environmentally benign die attach films for IC packaging.
Environmental issues for conventional PCBs.
Halogenated and halogen-free materials for flame retardation.
Fabrication of environmentally friendly PCB.
Global status of lead-free soldering.
Development of lead-free solder alloys.
Prevailing lead-free alloys.
Lead-free surface finishes.
Implementation of lead-free soldering.
Challenges for lead-free soldering.
Introduction to conducive adhesives.
Conductivity establishment of conductive adhesives.
Mechanisms underlying the unstable contact resistance of ECAs.
Stabilization of contact resistance of conductive adhesives.Relation: Electronic reproduction. New York, N.Y. : McGraw Hill, 2003. Mode of access: World Wide Web. System requirements: Web browser. Access may be restricted to users at subscribing institutions.
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8كتاب إلكتروني
المؤلفون: Oksana Ostroverkhova
نوع المادة: eBook.
الموضوعات: Nonlinear optics--Handbooks, manuals, etc, Electronic apparatus and appliances--Materials--Handbooks, manuals, etc, Optoelectronic devices--Materials--Handbooks, manuals, etc, Electrooptical devices--Handbooks, manuals, etc, Optical materials--Handbooks, manuals, etc
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9كتاب إلكتروني
المؤلفون: Natalia Chezhina, Dmitry Korolev
نوع المادة: eBook.
الموضوعات: Electronic structure, Materials--Electric properties, Electronic apparatus and appliances--Materials
تصنيفات: SCIENCE / Nanoscience, SCIENCE / Chemistry / General, SCIENCE / Chemistry / Industrial & Technical, SCIENCE / Life Sciences / General, TECHNOLOGY & ENGINEERING / Materials Science / General
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10كتاب إلكتروني
المؤلفون: Huixia Luo
نوع المادة: eBook.
الموضوعات: Solid state physics, Electronic apparatus and appliances--Materials, Topological insulators, Superconductors, Dielectrics