يعرض 1 - 10 نتائج من 4,943 نتيجة بحث عن '"Electronics Cooling"', وقت الاستعلام: 1.05s تنقيح النتائج
  1. 1
    مؤتمر
    Thermal Resistance of a Two Dimensional Flux Channel with Eccentric Heat Source and Asymmteric Edge Cooling

    المؤلفون: Razavi, M., Muzychka, Y.S., Kocabiyik, S.

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-9 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

    Full Text Finder
    أضف إلى المفضلة
  2. 2
    مؤتمر
    Investigation on Pulsating Heat Pipe (PHP) Heat Spreader Plate for Electronics Cooling

    المؤلفون: Hota, Sai Kiran, Lee, Kuan-Lin, Hoeschele, Greg, Rokkam, Srujan

    المصدر: 2024 40th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2024 40th. :1-6 Mar, 2024

    Relation: 2024 40th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

    Full Text Finder
    أضف إلى المفضلة
  3. 3
    دورية أكاديمية
    Thermal and Hydraulic Behavior of MEMS Heat Sinks Having Straight Microchannels Integrating Sidewall Cavities in Staggered Pattern

    المؤلفون: Alnaimat, F., Omar El-Saeh, N., Chew, B.T., Mathew, B.

    المصدر: IEEE Access Access, IEEE. 12:110920-110941 2024

    Full Text Finder
    أضف إلى المفضلة
  4. 4
    مؤتمر
    Novel Lightweight, Highly Thermally Conductive Graphene-Enhanced Heat Pipes for Electronics Cooling and Thermal Management Applications

    المؤلفون: Shen, Zhiyang, Chen, Jiajia, Guo, Sihua, Nkansah, Amos, Zhang, Hongfeng, Moller, Johan, Liu, Johan

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :339-340 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

    أضف إلى المفضلة
  5. 5
    مؤتمر
    Performance Comparison of Various Thermal Interface Materials Used with Metal Foams

    المؤلفون: Kemerli, Ubade, Joshi, Yogendra

    المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-7 May, 2023

    Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

    Full Text Finder
    أضف إلى المفضلة
  6. 6
    مؤتمر
    Performance Demonstration of a Dropwise Vapor Chamber for Highly Efficient Heat Spreading for Power Electronics

    المؤلفون: Luo, Kai, Li, Chen, Santi, Enrico

    المصدر: 2023 IEEE Electric Ship Technologies Symposium (ESTS) Electric Ship Technologies Symposium (ESTS), 2023 IEEE. :337-342 Aug, 2023

    Relation: 2023 IEEE Electric Ship Technologies Symposium (ESTS)

    Full Text Finder
    أضف إلى المفضلة
  7. 7
    رسالة جامعية
    Performance assessment of self-adaptive cooling devices under unsteady and non-uniform heat loads

    المؤلفون: Laguna Benet, Gerard

    المساهمون: University/Department: Universitat de Lleida. Departament de Medi Ambient i Ciències del Sòl

    مرشدي الرسالة: Barrau, Jérôme, Ibáñez, Manuel

    المصدر: TDX (Tesis Doctorals en Xarxa)

    مصطلحات موضوعية: Refrigeració autoadaptativa, Refrigeració d'electrònica, Refrigeració de fotovoltaica concentrada, Refrigeración autoadaptativa, Refrigeración de la electrónica, Refrigeración de fotovoltaica concentrada, Self-adaptive cooling, Electronics cooling, Concentrator photovoltaics cooling, Enginyeria Mecànica

    وصف الملف: application/pdf

    URL الوصول: http://hdl.handle.net/10803/669199

    أضف إلى المفضلة
  8. 8
    رسالة جامعية
    Energy efficient active cooling in advanced microelectronic systems

    المؤلفون: Vilarrubí, Montse

    المساهمون: University/Department: Universitat de Lleida. Departament de Medi Ambient i Ciències del Sòl

    مرشدي الرسالة: Barrau, Jérôme, Rosell Urrutia, Joan Ignasi

    المصدر: TDX (Tesis Doctorals en Xarxa)

    مصطلحات موضوعية: Refredament auto-adaptatiu, Refredament d'electrònica, Microfluídica, Refrigeración auto-adaptativa, Refrigeración de electrónica, Self-adaptive cooling, Electronics cooling, Microfluidics, Enginyeria Mecànica

    وصف الملف: application/pdf

    URL الوصول: http://hdl.handle.net/10803/668020

    أضف إلى المفضلة
  9. 9
    مؤتمر
    Experimental Comparison on Thermal Performance of Pulsating Heat Pipe and Embedded Heat Pipe Heat Spreaders

    المؤلفون: Hota, Sai Kiran, Lee, Kuan-Lin, Hoeschele, Greg, Bonner, Richard, Rokkam, Srujan

    المصدر: 2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2023 39th. :1-7 Mar, 2023

    Relation: 2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

    Full Text Finder
    أضف إلى المفضلة
  10. 10
    دورية أكاديمية
    Development of a lightweight, large-scale stainless-steel plate heat pipe (SPHP) fin for enhanced cooling in high-power electronics

    المؤلفون: Kim, Duk-Yong, Ji, Kyo-Sung, Seo, Jin Kook, Ryu, Chi-Back, Yang, Jun-Woo, Kim, Hye-Yeon, Yang, Wonseok, Yoo, Ki-Pung, Lee, Ingyu, Lee, Jooho, Hur, NahmkeonAff3, IDs1220602408479_cor11

    المصدر: Journal of Mechanical Science and Technology. 38(9):5147-5159

    Find this article in full text from Springer Verlag. Full Text Finder
    أضف إلى المفضلة
أدوات البحث: أحصل على تغذية RSS – أرسل هذا البحث بالبريد الإلكتروني – حفظ البحث – جدول التنبيهات: لا شيء