يعرض 1 - 10 نتائج من 10,649 نتيجة بحث عن '"Electronics packaging"', وقت الاستعلام: 1.50s تنقيح النتائج
  1. 1
    مؤتمر
    Reliability Analysis of Cu Sintered Die-Attach for SiC Power Devices: Mechanical, Electrical, and Thermal Evaluation

    المؤلفون: Liu, Xu, Wang, Shaogang, Hu, Dong, Gao, Chenshan, Huang, Qianming, Ye, Huaiyu, French, Paddy, Zhang, Guoqi

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1119-1123 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  2. 2
    مؤتمر
    An Iterative Algorithm for Unrolled Unsupervised PET Image Reconstruction

    المؤلفون: Wang, Siqi, Liu, Bing, Chai, Li

    المصدر: 2024 36th Chinese Control and Decision Conference (CCDC) Control and Decision Conference (CCDC), 2024 36th Chinese. :3241-3246 May, 2024

    Relation: 2024 36th Chinese Control and Decision Conference (CCDC)

    Full Text Finder
    أضف إلى المفضلة
  3. 3
    دورية أكاديمية
    Large-Scale Deterministic Networks: Architecture, Enabling Technologies, Case Study, and Future Directions

    المؤلفون: Tian, W., Gu, C., Guo, M., He, S., Kang, J., Niyato, D., Chen, J.

    المصدر: IEEE Network Network, IEEE. 38(4):284-291 Jul, 2024

    Full Text Finder
    أضف إلى المفضلة
  4. 4
    دورية أكاديمية
    Movement Primitive Diffusion: Learning Gentle Robotic Manipulation of Deformable Objects

    المؤلفون: Scheikl, P.M., Schreiber, N., Haas, C., Freymuth, N., Neumann, G., Lioutikov, R., Mathis-Ullrich, F.

    المصدر: IEEE Robotics and Automation Letters IEEE Robot. Autom. Lett. Robotics and Automation Letters, IEEE. 9(6):5338-5345 Jun, 2024

    Full Text Finder
    أضف إلى المفضلة
  5. 5
    دورية أكاديمية
    Robust Semi-Supervised 3D Medical Image Segmentation With Diverse Joint-Task Learning and Decoupled Inter-Student Learning

    المؤلفون: Zhou, Q., Yu, B., Xiao, F., Ding, M., Wang, Z., Zhang, X.

    المصدر: IEEE Transactions on Medical Imaging IEEE Trans. Med. Imaging Medical Imaging, IEEE Transactions on. 43(6):2317-2331 Jun, 2024

    Full Text Finder
    أضف إلى المفضلة
  6. 6
    دورية أكاديمية
    Meta-Learning-Based Predictive Energy Management for 4WD Battery Electric Vehicles

    المؤلفون: Feng, Z., Du, W., Chng, C., Chui, C., Zhao, S.

    المصدر: IEEE Transactions on Vehicular Technology IEEE Trans. Veh. Technol. Vehicular Technology, IEEE Transactions on. 73(5):6395-6408 May, 2024

    Full Text Finder
    أضف إلى المفضلة
  7. 7
    دورية أكاديمية
    Optimized and Automated Secure IC Design Flow: A Defense-in-Depth Approach

    المؤلفون: Gubbi, K.I., Latibari, B.S., Chowdhury, M.A., Jalilzadeh, A., Hamedani, E.Y., Rafatirad, S., Sasan, A., Homayoun, H., Salehi, S.

    المصدر: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 71(5):2031-2044 May, 2024

    Full Text Finder
    أضف إلى المفضلة
  8. 8
    مؤتمر
    Evaluating the Potential of Multipath TCP in Tactical Communications

    المؤلفون: Auler, Nils, Fuchs, Christoph, Schutz, Bertram, Weber, Daniel

    المصدر: 2024 International Conference on Military Communication and Information Systems (ICMCIS) Military Communication and Information Systems (ICMCIS), 2024 International Conference on. :01-07 Apr, 2024

    Relation: 2024 International Conference on Military Communication and Information Systems (ICMCIS)

    أضف إلى المفضلة
  9. 9
    مؤتمر
    A High-reliability SiC-based Power Module with High-Temperature Co-fired Ceramic Interposer for High-temperature Applications

    المؤلفون: Liu, Baihan, Lv, Jianwei, Yan, Yiyang, Du, Mengyao, Zhang, Yifan, Chen, Cai, Liu, Jiaxin, Kang, Yong, Yu, Chenjiang, Wang, Min

    المصدر: 2024 IEEE Applied Power Electronics Conference and Exposition (APEC) Applied Power Electronics Conference and Exposition (APEC), 2024 IEEE. :2551-2555 Feb, 2024

    Relation: 2024 IEEE Applied Power Electronics Conference and Exposition (APEC)

    Full Text Finder
    أضف إلى المفضلة
  10. 10
    كتاب
    Electronic Packaging Materials for Thermal Management

    المصدر: Thermal Management Materials for Electronic Packaging. May 10, 2024

    أضف إلى المفضلة
أدوات البحث: أحصل على تغذية RSS – أرسل هذا البحث بالبريد الإلكتروني – حفظ البحث – جدول التنبيهات: لا شيء