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1دورية أكاديمية
المؤلفون: Agrawal, S., Bhanderi, S., Elger, G.
المصدر: IEEE Access Access, IEEE. 12:34325-34341 2024
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2دورية أكاديمية
المؤلفون: Agrawal, S., Bhanderi, S., Doycheva, K., Elger, G.
المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 23(18):21493-21505 Sep, 2023
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3دورية أكاديمية
المؤلفون: Schmid, M., Zippelius, A., Hans, A., Bockhorst, S., Elger, G.
المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 23(3):419-429 Sep, 2023
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4دورية أكاديمية
المؤلفون: Kettelgerdes, M., Elger, G.
المصدر: IEEE Journal of Radio Frequency Identification IEEE J. Radio Freq. Identif. Radio Frequency Identification, IEEE Journal of. 7:192-202 2023
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5مؤتمر
المؤلفون: Tavakolibasti, M., Meszmer, P., Kettelgerdes, M., Bottger, G., Elger, G., Erdogan, H., Seshaditya, A., Wunderle, B.
المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-7 Apr, 2022
Relation: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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6دورية أكاديمية
المؤلفون: Schmid, M., Zippelius, A., Hans, A., Bockhorst, S., Elger, G.
المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 22(2):175-186 Jun, 2022
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7مؤتمر
المؤلفون: Tavakolibasti, M., Meszmer, P., Bottger, G., Kettelgerdes, M., Elger, G., Erdogan, H., Seshaditya, A., Wunderle, B.
المصدر: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021 22nd International Conference on. :1-9 Apr, 2021
Relation: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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8دورية أكاديمية
المؤلفون: Schmid, M., Bhogaraju, S.K., Hanss, A., Elger, G.
المصدر: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 70:1-9 2021
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9دورية أكاديمية
المؤلفون: Da Rosa Zanatta, M., Da Costa, J.P.C.L., Antreich, F., Haardt, M., Elger, G., Lopes De Mendonca, F.L., De Sousa, R.T.
المصدر: IEEE Access Access, IEEE. 8:174931-174942 2020
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10مؤتمر
المؤلفون: Hanss, A., Schmid, M., Elger, G.
المصدر: 2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-6 Sep, 2016
Relation: 2016 6th Electronic System-Integration Technology Conference (ESTC)