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مصطلحات موضوعية: Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/2304.04149

المؤلفون: Sheikh, Sofia, Ranaiefar, Meelad, Honarmandi, Pejman, Vela, Brent, Morcos, Peter, Shoukr, David, Arroyave, Raymundo, Karaman, Ibrahim, Elwany, Alaa

مصطلحات موضوعية: Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/2304.04113

المؤلفون: Tamraparni, Achutha, Hoe, Alison, Deckard, Michael, Zhang, Chen, Elwany, Alaa, Shamberger, Patrick J., Felts, Jonathan R.

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Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Mingear, Jacob, Zhang, Bing, Elwany, Alaa^{Aff1, Aff2}, Hartl, Darren^{Aff1, Aff3, IDs4083002300437x_cor4}

المصدر: Shape Memory and Superelasticity: Advances in Science and Technology. 9(3):504-519

المؤلفون: Sharar, Darin J., Wilson, Adam A., Leff, Asher, Smith, Andrew, Atli, K. Can, Elwany, Alaa, Arroyave, Raymundo, Karaman, Ibrahim

المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :821-826 Jul, 2020

Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Ye, Jiahui, El Desouky, Ahmed, Elwany, Alaa

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المؤلفون: Elsayed, Abdelrahman, Guleria, Taresh, Atli, Kadri C., Bolmin, Ophelia, Young, Benjamin, Noell, Philip J, Boyce, Brad L, Elwany, Alaa, Arroyave, Raymundo, Karaman, Ibrahim

المصدر: In Materials & Design August 2024 244

المؤلفون: Hoffmann, Miguel, Heinrich, Lauren, Paramanathan, Mithulan, Fillingim, Kenton B., Elwany, Alaa, Feldhausen, Thomas

المصدر: In Journal of Manufacturing Processes 15 October 2024 127:446-456

المؤلفون: Huang, Xueqin, Seede, Raiyan, Karayagiz, Kubra, Whitt, Austin, Zhang, Bing, Ye, Jiahui, Karaman, Ibrahim, Elwany, Alaa, Arróyave, Raymundo

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المؤلفون: Hoffmann, Miguel, Elwany, Alaa

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