نتائج البحث - "Emmanuel, Arriola"

1

مؤتمر

Packaging of 20 kV Double-Side Cooled Silicon Carbide Diode Module With Electrical Insulation Enhanced by a Polymer-Nanoparticle Coating

المؤلفون: Zhang, Zichen, Nicholas, Carl, Emmanuel, Arriola, Ngo, Khai D.T., Lu, Guo-Quan, Lynch, Justin, Yun, Nick, Morgan, Adam, Sung, Woongje

المصدر: 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) Power Electronics and Applications (EPE'23 ECCE Europe), 2023 25th European Conference on. :P.1-P.6 Sep, 2023

Relation: 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe)

2

DEVELOPMENT OF AN ENERGY AUDIT WORKING PROCEDURE FOR AN ACADEMIC UNIVERSITY OFFICE BUILDING IN THE PHILIPPINES

المؤلفون: Emmanuel Arriola, Joseph Gerard T. Reyes, Maxine Chan, Reynaldo Cuevas

المصدر: ASEAN Engineering Journal. 11:88-95

مصطلحات موضوعية: Environmental Engineering, business.industry, General Chemical Engineering, General Engineering, Energy Engineering and Power Technology, Energy consumption, Audit, Geotechnical Engineering and Engineering Geology, Computer Science Applications, Unit (housing), Power consumption, Air conditioning, Operations management, Electricity, business, Energy (signal processing)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::614ba11b527b1dcbe2093450b5c9c4bd
https://doi.org/10.11113/aej.v11.16669

3

A bibliometric review on the application of fuzzy optimization to sustainable energy technologies

المؤلفون: Emmanuel Arriola, Wei Hsin Chen, Aristotle T. Ubando

المصدر: International Journal of Energy Research. 46:6-27

مصطلحات موضوعية: Fuel Technology, Bibliometric analysis, Nuclear Energy and Engineering, Renewable Energy, Sustainability and the Environment, Computer science, Sustainability, Energy Engineering and Power Technology, Environmental economics, Fuzzy logic, Energy (signal processing), Sustainable energy

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::aadafb9a9fc0833a08e96add0f9008af
https://doi.org/10.1002/er.5729

View record at Wiley

4

Material Properties Sensitivity Analysis Based on Thermomechanical Analysis on Warpage for Ball Grid Array Semiconductor Packaging

المؤلفون: Jeremias A. Gonzaga, Aristotle T. Ubando, N R E Lim, R L Moran, Richard Dimagiba, J P Mercado, Emmanuel Arriola

المصدر: 2019 IEEE 11th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management ( HNICEM ).

مصطلحات موضوعية: 010302 applied physics, Materials science, 020208 electrical & electronic engineering, Semiconductor device modeling, Mechanical engineering, Semiconductor package, 02 engineering and technology, 01 natural sciences, Finite element method, Material selection, Ball grid array, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Thermomechanical analysis, Integrated circuit packaging, Material properties

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::60bc0569f41e2dd43e1436b997b7543c
https://doi.org/10.1109/hnicem48295.2019.9073437

5

Reduction of IC Package Warpage through Finite Element Analysis and Direct Optimization

المؤلفون: Emmanuel Arriola, J P Mercado, Richard Dimagiba, R L Moran, Aristotle T. Ubando, N R E Lim, Jeremias A. Gonzaga

المصدر: 2019 IEEE 11th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management ( HNICEM ).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a4d0f81b48a7f356a19c26c5fa06d578
https://doi.org/10.1109/hnicem48295.2019.9072881

6

Evaluation of the Effects of Introducing Channels to Composite Materials to Reduce Warpage on Semiconductor Packages Due to Coefficient of Thermal Expansion Mismatch

المؤلفون: J P Mercado, Emmanuel Arriola, R L Moran, N R E Lim, Jeremias A. Gonzaga, Aristotle T. Ubando, Richard Dimagiba

المصدر: 2019 IEEE 11th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management ( HNICEM ).

مصطلحات موضوعية: 010302 applied physics, Materials science, Composite number, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Durability, Finite element method, Thermal expansion, Stress (mechanics), Reliability (semiconductor), visual_art, 0103 physical sciences, visual_art.visual_art_medium, Thermomechanical analysis, Ceramic, Composite material, 0210 nano-technology