المؤلفون: Gao, R., Mehedi, M., Chen, H., Wang, X., Zhang, J. F., Lin, X. L., He, Z. Y., Chen, Y. Q., Lei, D. Y., Huang, Y., En, Y. F., Ji, Z., Wang, R.

المصدر: 2020 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2020 IEEE International. :1-5 Apr, 2020

Relation: 2020 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Wang, J. L., Chen, Y. Q., He, Z. Y., En, Y. F., Xu, X. B., Huang, Y., Geng, K. W.

المصدر: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2019 IEEE 26th International Symposium on. :1-4 Jul, 2019

Relation: 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Yin, T., Li, S. J., Chen, Y. Q., Liao, X. Y., Li, R. G., En, Y. F., Huang, Y.

المصدر: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2017 IEEE 24th International Symposium on the. :1-4 Jul, 2017

Relation: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Chen, Y. Q., Wang, B., Zhang, Y. F., En, Y. F., Huang, Y., Lu, Y. D., Liu, L. X., Wang, X. H.

المصدر: Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the. :353-356 Jul, 2013

Relation: 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Lu, G.-G., Lei, Z.-F., Huang, Y., En, Y.-F.

المصدر: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on. :1106-1109 Aug, 2012

Relation: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

المؤلفون: Zhou, B., Zhou, Q., En, Y.-F.

المصدر: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on. :1317-1319 Aug, 2012

Relation: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

المؤلفون: Liu, Y., Wu, W.-J., En, Y.-F., Wang, L., Lei, Z.-F., Wang, X.-H.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 35(3):369-371 Mar, 2014

المؤلفون: Chen, Y. Q., En, Y. F., Huang, Y., Kong, X. D., Fang, W. X., Zheng, X. J.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 33(1):110-112 Jan, 2012

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