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المؤلفون: Victor C. Y. Chang, C. S. Liu, Jeng-Shien Hsieh, Feng Wei Kuo, Doug C. H. Yu, Hao-Yi Tsai, En-Hsiang Yeh, Chih-Hua Chen, Chewn-Pu Jou, Ron Chen, Ying-Ta Lu, Hsu-Hsien Chen, Chuei-Tang Wang
المصدر: 3DIC
مصطلحات موضوعية: Voltage-controlled oscillator, Engineering, CMOS, business.industry, Q factor, Noise reduction, Electrical engineering, Electronic engineering, Fan-out, Wafer, business, Inductor, Wafer-level packaging
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e9662d9d155b6ef1cb8e138ba1ce90f0
https://doi.org/10.1109/3dic.2015.7334573 -
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المؤلفون: C.H. Tsai, H. H. Chuang, K. C. Yee, W. S. Liao, C.H. Yu, Doug C. H. Yu, C. T. Wang, Chia-Chia Lin, T. H. Peng, Liang-Ju Yen, J. N. Hung, W. C. Lai, C. C. Sheu, En-Hsiang Yeh
المصدر: 2013 IEEE International Electron Devices Meeting.
مصطلحات موضوعية: Fabrication, Electric power transmission, Materials science, business.industry, Electrical engineering, Interposer, Mixed-signal integrated circuit, Signal integrity, Integrated circuit packaging, business, Inductor, Chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::35c1cb2f48bbce2583565e4d739529d5
https://doi.org/10.1109/iedm.2013.6724624 -
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المؤلفون: Chung-Shi Liu, En-Hsiang Yeh, Monsen Liu, Jeng-Shien Hsieh, Ching-Wen Hsiao, Chuei-Tang Wang, Chung-Hao Tsai, Doug C. H. Yu, Chen-Shien Chen, Hsu-Hsien Chen, Mirng-Ji Lii
المصدر: 2013 IEEE International Electron Devices Meeting.
مصطلحات موضوعية: Engineering, Coaxial antenna, business.industry, Antenna measurement, Electrical engineering, Antenna factor, law.invention, Antenna array, Microstrip antenna, law, Dipole antenna, Antenna (radio), business, Monopole antenna
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f24c7397624ab8f65cd58e6369ec3cc9
https://doi.org/10.1109/iedm.2013.6724687 -
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المؤلفون: En-Hsiang Yeh, Cheng-chieh Hsieh, John Yeh, Shang-Yun Hou, Jing-Cheng Lin, Ming-Yen Chiu, Shin-puu Jeng, Chewn-Pu Jou, Douglas Yu, Chuei-Tang Wang, Li-Hsien Huang, Tzu-Jin Yeh, Chen Shuo-Mao, Huan-Neng Chen, Jui-Pin Hung, Tsung-Shu Lin, Feng Wei Kuo, Christianto Chih-Ching Liu
المصدر: 2012 International Electron Devices Meeting.
مصطلحات موضوعية: Engineering, business.industry, Electrical engineering, Hardware_PERFORMANCEANDRELIABILITY, Inductor, Embedded Wafer Level Ball Grid Array, Hardware_GENERAL, Q factor, Ball grid array, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, System integration, Radio frequency, Integrated circuit packaging, business, Wafer-level packaging
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::08a6cdbb29a58afdf56ee27ef44ca5c4
https://doi.org/10.1109/iedm.2012.6479039