المؤلفون: Wei Liu, Wen-xing Kan, Pei Fu, Teng-jiang Hu, Wei Ren, En-yi Chu, Yu-long Zhao, Rui-zhen Xie, Xiao-ming Ren, Lan Liu

المصدر: AIP Advances, Vol 14, Iss 3, Pp 035328-035328-12 (2024)

مصطلحات موضوعية: Physics, QC1-999

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2158-3226

URL الوصول: https://doaj.org/article/2162b847d59a406899b3246f06eabc08

المؤلفون: Rui-shan Han, Fei-peng Lu, Fang Zhang, Yan-lan Wang, Mi Zhou, Guo-sheng Qin, Jian-hua Chen, Hai-fu Wang, En-yi Chu

المصدر: Defence Technology, Vol 25, Iss , Pp 166-173 (2023)

مصطلحات موضوعية: Microfluidics, HNS microspheres, Thermal stability, Ignition threshold, Military Science

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S221491472200099X; https://doaj.org/toc/2214-9147

URL الوصول: https://doaj.org/article/f8cfe4a7ae584e1e9ec0ff6f29c73d53

المؤلفون: Wei Liu, Xiao-ming Ren, Rui-zhen Xie, Lan Liu, Ke-xin Yu, Xiang-fei Ji, Wei Ren, En-yi Chu

المصدر: AIP Advances, Vol 13, Iss 3, Pp 035207-035207-7 (2023)

مصطلحات موضوعية: Physics, QC1-999

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2158-3226

URL الوصول: https://doaj.org/article/c1060f5944a443c998f17d63b3c14bac

المؤلفون: Rui-shan Han, Fei-peng Lu, Fang Zhang, Yan-lan Wang, Mi Zhou, Guo-sheng Qin, Jian-hua Chen, Hai-fu Wang, En-yi Chu

المصدر: Defence Technology.

مصطلحات موضوعية: Mechanical Engineering, Metals and Alloys, Ceramics and Composites, Computational Mechanics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e215b16fc51c0d8d8e86e43677c804a3
https://doi.org/10.1016/j.dt.2022.05.006

المؤلفون: Yue Ma, Chunqiang Cao, Ya-dong Hu, Haoyu Wang, Aifeng He, Jin Hong, En-yi Chu, Bo Jing

المصدر: Young Scientists Forum 2017.

مصطلحات موضوعية: Materials science, Laser diode, business.industry, Detonation, Hardware_PERFORMANCEANDRELIABILITY, Laser, Capacitance, Energy storage, law.invention, law, Hardware_INTEGRATEDCIRCUITS, Miniaturization, Optoelectronics, business, Pulse-width modulation, Voltage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0d5248e03d1743afffc822cb06b124b4
https://doi.org/10.1117/12.2317656

المؤلفون: Ju Peng Liu, Rui Zhang, Di Lun Sheng, Sheng Li Zhou, En Yi Chu, Lin Zhang

المصدر: Applied Mechanics and Materials. :210-213

مصطلحات موضوعية: Morphology (linguistics), Materials science, Metallurgy, Self assemble, Iron oxide, chemistry.chemical_element, General Medicine, Hydrothermal circulation, Self assembled, chemistry.chemical_compound, chemistry, Chemical engineering, Aluminium, Nano, Nanoring

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::299fd9c9b9ee93df714523c151ef2bf3
https://doi.org/10.4028/www.scientific.net/amm.446-447.210

المؤلفون: Zhang Rui, Ying-Wei Bai, Jiang Zhuangde, En-yi Chu, Yulong Zhao

المصدر: 2008 IEEE International Conference on Industrial Technology.

مصطلحات موضوعية: Engineering, Explosive material, business.industry, Acoustics, System testing, ComputerApplications_COMPUTERSINOTHERSYSTEMS, Temperature measurement, Sensitivity (explosives), Explosive device, Hardware_GENERAL, Measuring instrument, Electronic engineering, Deflagration, Current (fluid), business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::82a094748cf2a908d5f5cf9782eece3d
https://doi.org/10.1109/icit.2008.4608664

المؤلفون: Kexuan Wang, Jiang Zhuangde, Yulong Zhao, En-yi Chu, Ying-Wei Bai

المصدر: 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems.

مصطلحات موضوعية: Shock wave, Hydrostatic test, Materials science, Explosive material, business.industry, Acoustics, Detonation, Structural engineering, business, Pressure sensor, Electronic circuit

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d0842d9e020715956919d5af50f23db2
https://doi.org/10.1115/micronano2008-70078

المؤلفون: Ying-Wei Bai, Zhuang-De Jiang, Yu-Long Zhao, Rui Zhang, En-yi Chu

المصدر: 2008 IEEE International Conference on Industrial Technology; 2008, p1-5, 5p