المؤلفون: InRak.Kim, Nari.Kim, Gayoung.Shin, Youngdo.Kweon, Nathan.Whitchurch

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :949-954 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Balestra, L., Gnani, E., Rossetti, M., Depetro, R., Reggiani, S.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(4):2565-2569 Apr, 2024

المؤلفون: Wan, C., Zeng, Z., Xiao, G., Lan, Y., Li, C., Lin, H., Wang, H.

المصدر: IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 35(24):1387-1390 Dec, 2023

المؤلفون: Phansalkar, Sukrut Prashant, Mittakolu, Roshith, Han, Bongtae

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :2093-2100 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Mamun, M. Asaduz Zaman, Mavinkurve, Amar, van Soestbergen, Michiel, Alam, Muhammad A.

المصدر: 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-7 Mar, 2023

Relation: 2023 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Yan, Zhenghan, Zhong, Cheng, Lou, Lecheng, Yu, Shuhui, Hu, Zhengxun, Sun, Rong

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Li, Yulong, Zhong, Cheng, Peng, Xu, Li, Chenglong, Jiang, Ruoyu, Lu, Jibao, Sun, Rong

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Franieck, Erick, Fleischmann, Martin, Holck, Ole, Schneider-Ramelow, Martin

المصدر: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2021 23rd European. :1-8 Sep, 2021

Relation: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Chen, B., Hwang, S., Chang, Y., Yang, Y., Lee, H., Huang, B., Hu, I., Chen, D., Tarng, D., Hung, C.P.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(1):174-184 Jan, 2022

المؤلفون: Yoo, Jongkyu, Im, Yunhyeok, Lee, Heeseok, Cho, Young-Sang, An, Taekeun, Lee, Hoi-Jin, Shin, Youngmin

المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :229-235 Jul, 2020

Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)