المؤلفون: Kumar, Balasubramanian Senthil, Murali, Sarangapani, Tae, Kang Il, Evonne, Lim Yee Weon, Wei, Tok Chee, James, Kim Tae Yeop, Eric, Tan Swee Seng, Xi, Zhang

المصدر: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-6 Dec, 2017

Relation: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Murali Sarangapani, Eric Tan Swee Seng, Jason Wong Chin Yeung

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Wire bonding, Materials science, Transmission electron microscopy, visual_art, visual_art.visual_art_medium, Intermetallic, Temperature cycling, Epoxy, Composite material, Selected area diffraction, Phase formation, Highly accelerated stress test

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b7b59d23396dc4d8df7b0b9a2bb697e9
https://doi.org/10.1109/ectc.2019.00314