المؤلفون: Eric Kuah Teng Hock, Zhao Bao Zong, Lee, S.G., Ho, S.C., Srikanth, N.

المصدر: 53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :365-372 2003

Relation: 53rd Electronic Components and Technology Conference, 2003. Proceedings.

المؤلفون: Th, Eric Kuah, Hao, J Y, Ding, J P, Li, Q F, Chan, W L, Ho, S C, Huang, H M, Jiang, Y J

المصدر: 2009 11th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2009. EPTC '09. 11th. :903-908 Dec, 2009

Relation: 2009 11th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Sze Pei Lim, Cheng-Ta Ko, Henry Yang, Tony Chen, Cao Xi, Eric Kuah, Zhang Li, Hsing-Hui Wu, Jeffery C. C. Lo, Yu-Hua Chen, Chieh-Lin Chang, Jhih-Yuan Pan, Kim Hwee Tan, John H. Lau, Mian Tao, Junfen Lin, Nelson Fan, Ning Cheng Lee, Iris Xu, Penny Lo, Marc Lin, Margie Li, Ming Li, Ricky Lee, Rozalia Beica, Chia-Hung Lin, Curry Lin

المصدر: International Symposium on Microelectronics. 2018:000057-000063

مصطلحات موضوعية: 010302 applied physics, Fabrication, Materials science, Computer Networks and Communications, business.industry, 020208 electrical & electronic engineering, Fan-out, Dielectric, Epoxy, 02 engineering and technology, Photoresist, Chip, 01 natural sciences, Electronic, Optical and Magnetic Materials, Conductor, Printed circuit board, visual_art, 0103 physical sciences, Automotive Engineering, visual_art.visual_art_medium, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, Electrical and Electronic Engineering, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4ec134f623ce6fdc187807dc5c121c26
https://doi.org/10.4071/2380-4505-2018.1.000057

المؤلفون: Wu Kai, Iris Xu, Ji Hao, Tony Chen, Margie Li, Qing Xiang Yong, Ming Li, Zhang Li, Henry Yang, Zhong Cheng, Sze Pei Lim, Ricky Lee, Koh Sau Wee, Curry Lin, Hsing-Hui Wu, Cheng-Ta Ko, Yiu Ming Cheung, Rozalia Beica, Kim Hwee Tan, Jeffery C. C. Lo, Jiang Ran, Cao Xi, Eric Kuah, John H. Lau, Marc Lin, Yu-Hua Chen, Ning-Cheng Lee, Mian Tao, Nelson Fan, Jhih-Yuan Pan, Chieh-Lin Chang, Eric Ng, Jin Lin

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:1561-1572

مصطلحات موضوعية: Materials science, Fabrication, Mechanical engineering, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Temperature cycling, Photoresist, 01 natural sciences, Industrial and Manufacturing Engineering, law.invention, Printed circuit board, Reliability (semiconductor), law, Plating, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Electrical and Electronic Engineering, 010302 applied physics, business.industry, 020208 electrical & electronic engineering, Fan-out, 021001 nanoscience & nanotechnology, Chip, Electronic, Optical and Magnetic Materials, Capacitor, Resist, Optoelectronics, 0210 nano-technology, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3270e7214d93e6150976a379ff1a6d59
https://doi.org/10.1109/tcpmt.2018.2848665

المؤلفون: TH Eric Kuah, Hao Ji Yuan, Wu Kai, Li Ming, John H. Lau, Margie Li, Nelson Fan, Catherine Chan, Eric Ng

المصدر: International Symposium on Microelectronics. 2017:000747-000753

مصطلحات موضوعية: Engineering drawing, Engineering, business.industry, Automotive Engineering, Wafer, Large format, business, Manufacturing engineering, Encapsulation (networking)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::09a75fef24c8a814c400c0225f6e8a6e
https://doi.org/10.4071/isom-2017-thp42_049

المؤلفون: Jeffery C. C. Lo, Jiang Ran, Yiu Ming Cheung, Thomas Taylor, Ning-Cheng Lee, Rozalia Beica, Cheng-Ta Ko, Sze Pei Lim, Wu Kai, Nelson Fan, Koh Sau Wee, Ming Li, Yao-Der Chen, Ricky Lee, Margie Li, John H. Lau, Zhang Li, Cao Xi, Eric Kuah, Iris Xu, Qingxiang Yong, Kim Hwee Tan, Mian Tao, Henry Yang, Tony Chen, Ji Hao

المصدر: Journal of Microelectronics and Electronic Packaging. 14:123-131

مصطلحات موضوعية: 010302 applied physics, Materials science, Computer Networks and Communications, business.industry, Compression molding, Fan-out, 02 engineering and technology, Epoxy, 021001 nanoscience & nanotechnology, Chip, 01 natural sciences, Electronic, Optical and Magnetic Materials, visual_art, 0103 physical sciences, visual_art.visual_art_medium, Optoelectronics, Wafer dicing, Wafer, Redistribution layer, Electrical and Electronic Engineering, 0210 nano-technology, business, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9b7b30715af2e4dfd2bb7d8b86d3283f
https://doi.org/10.4071/imaps.522798

المؤلفون: Kim Hwee Tan, Zhang Li, Sze Pei Lim, Koh Sau Wee, Thomas Taylor, Yu-Hua Chen, Dewen Tian, Cao Xi, Cheng-Ta Ko, Eric Kuah, Ji Hao, Yiu Ming Cheung, John H. Lau, Margie Li, Jiang Ran, Wu Kai, Henry Yang, Qingxiang Yong, Ming Li, Nelson Fan, Ning Cheng Lee, Rozalia Beica

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1729-1738

مصطلحات موضوعية: 010302 applied physics, Engineering drawing, Materials science, Wafer-scale integration, Fabrication, Thermal resistance, Compression molding, 02 engineering and technology, Molding (process), Epoxy, 021001 nanoscience & nanotechnology, Chip, 01 natural sciences, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials, visual_art, 0103 physical sciences, visual_art.visual_art_medium, Electrical and Electronic Engineering, Composite material, 0210 nano-technology, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::24a185d0ba868c4c5f69a2d9e02f55d5
https://doi.org/10.1109/tcpmt.2017.2715185

المؤلفون: Wu Kai, Iris Xu, Jiang Ran, Henry Yang, Zhang Li, Sze Pei Lim, Nelson Fan, Rozalia Beica, Cao Xi, Kim Hwee Tan, Eric Kuah, Ken Cheung, Qingqian Li, Cheng-Ta Ko, John H. Lau, Dong Chen, Ming Li

المصدر: International Symposium on Microelectronics. 2017:000557-000562

مصطلحات موضوعية: 010302 applied physics, Engineering drawing, Fabrication, Materials science, business.industry, 020208 electrical & electronic engineering, Compression molding, 02 engineering and technology, 01 natural sciences, Grinding, Die preparation, 0103 physical sciences, Automotive Engineering, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, Wafer testing, Wafer, business, Lithography, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::27e97cd79087028f45fe0b90b31e7d40
https://doi.org/10.4071/isom-2017-tha31_057

المؤلفون: John Lau, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen, Iris Xu, Margie Li, Y. M. Cheung, Wu Kai, Ji Hao, Rozalia Beica, Tom Taylor, CT Ko, Henry Yang, YH Chen, Sze Pei Lim, NC Lee, Jiang Ran, Koh Sau Wee, Qingxiang Yong, Cao Xi, Mian Tao, Jeffery Lo, Ricky Lee

المصدر: International Symposium on Microelectronics. 2017:000576-000583

مصطلحات موضوعية: 010302 applied physics, 020208 electrical & electronic engineering, 0103 physical sciences, Automotive Engineering, 0202 electrical engineering, electronic engineering, information engineering, 02 engineering and technology, 01 natural sciences

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b2051715e6fbe15d886935f9db7c010b
https://doi.org/10.4071/isom-2017-tha35_056

المؤلفون: ERIC KUAH

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b318473452b26ffc0b53a8073cb960b5
https://doi.org/10.1142/9789811209666_0007