المؤلفون: Raj, A., Sanders, T., Sridhar, S., Evans, J.L., Bozack, M.J., Johnson, W.R., Carpenter, D.M.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(6):1082-1093 Jun, 2019

المؤلفون: Suhling, J.C., Gale, H.S., Johnson, R.W., Islam, M.N., Shete, T., Lall, P., Bozack, M.J., Evans, J.L., Ping Seto, Gupta, T., Thompson, J.R.

المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on. 2:350-357 Vol.2 2004

Relation: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems

المؤلفون: Schweizer, S.M., Stonick, V.L., Evans, J.L.

المصدر: 1996 IEEE International Conference on Acoustics, Speech, and Signal Processing Conference Proceedings Acoustics, speech and signal processing Acoustics, Speech, and Signal Processing, 1996. ICASSP-96. Conference Proceedings., 1996 IEEE International Conference on. 3:1609-1612 vol. 3 1996

Relation: 1996 IEEE International Conference on Acoustics, Speech, and Signal Processing Conference Proceedings

المؤلفون: Farrington, P.A., Swain, J.J., Ayokanmbi, M., Evans, J.L., Rogers, J.S.

المصدر: Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International. :179-186 1995

Relation: Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'

المؤلفون: Farrington, P.A., Rogers, J.S., Schroer, B.J., Swain, J.J., Evans, J.L., Yun-Cheng Feng

المصدر: Winter Simulation Conference Proceedings, 1995. Simulation Simulation Conference Proceedings, 1995. Winter. :917-924 1995

Relation: Proceedings of 1995 Winter Simulation Conference

المؤلفون: Evans, J.L., Bosley, L.E., Romanczuk, C., Johnson, R.W.

المصدر: Proceedings of the International Conference on Multichip Modules Multichip Modules, 1994. Proceedings of the 1994 International Conference on. :326-331 1994

Relation: Proceedings of the International Conference on Multichip Modules

المؤلفون: Johnson, R.W., Evans, J.L., Jacobsen, P., Thompson, J.R., Christopher, M.

المصدر: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 27(3):164-176 Jul, 2004

المؤلفون: Farrington, P.A., Swain, J.J., Evans, J.L., Rogers, J.S.

المصدر: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C IEEE Trans. Comp., Packag., Manufact. Technol. C Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on. 19(2):89-97 Apr, 1996

المؤلفون: Evans, J.L., Bosley, L.E., Romanczuk, C.S., Johnson, R.W.

المصدر: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B IEEE Trans. Comp., Packag., Manufact. Technol. B Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on. 18(1):28-32 Feb, 1995

المؤلفون: Hai, Z., Zhang, J., Shen, C., Evans, J.L., Bozack, M.J., Basit, M.M., Suhling, J.C.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 5(6):828-837 Jun, 2015