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1
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2تقرير
المؤلفون: Ishida, Natsuko, Ezawa, Motohiko, Lu, Guangtai, Lin, Wenbo, Ota, Yasutomo, Arakawa, Yasuhiko, Iwamoto, Satoshi
مصطلحات موضوعية: Condensed Matter - Mesoscale and Nanoscale Physics
URL الوصول: http://arxiv.org/abs/2406.08826
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3
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4تقرير
المؤلفون: Bampoulis, Pantelis, Castenmiller, Carolien, Klaassen, Dennis J., Mil, Jelle v., de Boeij, Paul L., Ezawa, Motohiko, Zandvliet, Harold J. W.
مصطلحات موضوعية: Condensed Matter - Mesoscale and Nanoscale Physics
URL الوصول: http://arxiv.org/abs/2403.14560
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5تقرير
المؤلفون: Ezawa, Motohiko
المصدر: Phys. Rev. B 109, 245306 (2024)
مصطلحات موضوعية: Condensed Matter - Mesoscale and Nanoscale Physics
URL الوصول: http://arxiv.org/abs/2403.09150
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6تقرير
المؤلفون: Sone, Kazuki, Ezawa, Motohiko, Gong, Zongping, Sawada, Taro, Yoshioka, Nobuyuki, Sagawa, Takahiro
مصطلحات موضوعية: Condensed Matter - Mesoscale and Nanoscale Physics, Condensed Matter - Statistical Mechanics, Nonlinear Sciences - Chaotic Dynamics
URL الوصول: http://arxiv.org/abs/2403.03038
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7تقرير
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8دورية أكاديمية
المؤلفون: Sone, KazukiAff1, IDs4156702402451x_cor1, Ezawa, Motohiko, Ashida, YutoAff2, Aff3, Yoshioka, NobuyukiAff1, Aff4, Aff5, Sagawa, TakahiroAff1, Aff6
المصدر: Nature Physics. 20(7):1164-1170
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9مؤتمر
المؤلفون: Yasunaga, Shun, Ezawa, Motohiko, Tsuji, Keigo, Misumi, Kei, Sawamura, Tomoki, Tsuboi, Shinji, Mizushima, Ayako, Ochiai, Yukinori, Higo, Akio, Mita, Yoshio
المصدر: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :453-456 Jun, 2023
Relation: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)
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10مؤتمر
المؤلفون: Mita, Yoshio, Yasunaga, Shun, Tsuji, Keigo, Higo, Akio, Iizuka, Tetsuya, Ezawa, Motohiko
المصدر: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), 2023 Symposium on. :1-4 May, 2023
Relation: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)