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المؤلفون: F. Guyader, P. Batude, P. Malinge, E. Vire, J. Lacord, J. Jourdon, J. Poulet, L. Gay, F. Ponthenier, S. Joblot, A. Farcy, L. Brunet, A. Albouy, C. Theodorou, M. Ribotta, D. Bosch, E. Ollier, D. Muller, M. Neyens, D. Jeanjean, T. Ferrotti, E. Mortini, J.G. Mattei, A. Inard, R. Fillon, F. Lalanne, F. Roy, E. Josse
المصدر: 2022 International Electron Devices Meeting (IEDM).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b8c8470b7f599580ca94cfd1cec41f23
https://doi.org/10.1109/iedm45625.2022.10019432 -
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المؤلفون: P. Batude, O. Billoint, S. Thuries, P. Malinge, C. Fenouillet-Beranger, A. Peizerat, G. Sicard, P. Vivet, S. Reboh, C. Cavalcante, L. Brunet, M. Ribotta, L. Brevard, X. Garros, T. Mota Frutuoso, B. Sklenard, J. Lacord, J. Kanyandekwe, S. Kerdiles, P. Sideris, C. Theodorou, V. Lapras, M. Mouhdach, G. Gaudin, G. Besnard, I. Radu, F. Ponthenier, A. Farcy, E. Jesse, F. Guyader, T. Matheret, P. Brunet, F. Milesi, L. Le Van-Jodin, A. Sarrazin, B. Perrin, C. Moulin, S. Maitrejean, M. Alepidis, I. Ionica, S. Cristoloveanu, F. Gaillard, M. Vinet, F. Andrieu, J. Arcamone, E. Ollier
المصدر: 2021 IEEE International Electron Devices Meeting (IEDM).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a954addef7e27e3dfae349b36fd38937
https://doi.org/10.1109/iedm19574.2021.9720671 -
3دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
4دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
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المؤلفون: S. Lhostis, A. Farcy, E. Deloffre, F. Lorut, S. Mermoz, Y. Henrion, L. Berthier, F. Bailly, D. Scevola, F. Guyader, F. Gigon, C. Besset, S. Pellissier, L. Gay, N. Hotellier, A. -L. Le Berrigo, S. Moreau, V. Balan, F. Fournel, A. Jouve, S. Cheramy, M. Arnoux, B. Rebhan, G. A. Maier, L. Chitu
المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Wire bonding, Interconnection, Materials science, Copper interconnect, 02 engineering and technology, Direct bonding, 021001 nanoscience & nanotechnology, 01 natural sciences, Die (integrated circuit), CMOS, 0103 physical sciences, Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Wafer, Image sensor, 0210 nano-technology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e802e06becc6637eabb0931ccd7563e4
https://doi.org/10.1109/ectc.2016.202 -
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المؤلفون: F. Guyader, O. Simonetti, Gerard Ghibaudo, M. Bidaud, Mouenes Fadlallah
المصدر: Microelectronic Engineering. 72:241-246
مصطلحات موضوعية: Materials science, business.industry, Gate dielectric, Oxide, Equivalent oxide thickness, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, PMOS logic, chemistry.chemical_compound, International Technology Roadmap for Semiconductors, chemistry, Gate oxide, Optoelectronics, SILC, Electrical and Electronic Engineering, business, NMOS logic
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المؤلفون: A. Meinertzhagen, O. Simonetti, Gerard Ghibaudo, M. Bidaud, C. Petit, Mouenes Fadlallah, F. Guyader
المصدر: Microelectronics Reliability. 43:1433-1438
مصطلحات موضوعية: Materials science, business.industry, Time-dependent gate oxide breakdown, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, PMOS logic, Gate oxide, Degradation (geology), Optoelectronics, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Thin oxide, Gate current
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المؤلفون: F. Guyader, C. Richard, Kathy Barla
المصدر: Solid State Phenomena. 92:121-124
مصطلحات موضوعية: Materials science, chemistry, Metallurgy, Copper plating, chemistry.chemical_element, General Materials Science, Condensed Matter Physics, Copper, Atomic and Molecular Physics, and Optics
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7306c01b07a66827e6d8e81f18609e37
https://doi.org/10.4028/www.scientific.net/ssp.92.121 -
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المؤلفون: A. Beverina, V. Huard, N. Emonet, R. Velard, J.-P. Carrere, Sébastien Petitdidier, I. Guilmeau, F. Guyader
المصدر: Solid State Phenomena. 92:235-238
مصطلحات موضوعية: chemistry.chemical_compound, Materials science, Resist, chemistry, Etching (microfabrication), business.industry, Oxide, Optoelectronics, General Materials Science, Condensed Matter Physics, Dual gate, business, Atomic and Molecular Physics, and Optics
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8ed3b5f673608a560cddedbc21066993
https://doi.org/10.4028/www.scientific.net/ssp.92.235 -
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المؤلفون: F. Guyader, Kathy Barla, Franck Arnaud, Jean-Luc Autran, M. Bidaud
المصدر: Journal of Non-Crystalline Solids. 280:32-38
مصطلحات موضوعية: Materials science, business.industry, Gate dielectric, Process (computing), Oxide, Nanotechnology, Equivalent oxide thickness, Hardware_PERFORMANCEANDRELIABILITY, Condensed Matter Physics, Engineering physics, Electronic, Optical and Magnetic Materials, chemistry.chemical_compound, Semiconductor, chemistry, Rapid thermal processing, Gate oxide, Hardware_INTEGRATEDCIRCUITS, Materials Chemistry, Ceramics and Composites, Miniaturization, business, Hardware_LOGICDESIGN