المؤلفون: A. Weert, K. Ogata, F. Vinci, C. Leo, G. Bertotti, J. Amory, S. Tavani

المصدر: Solid Earth, Vol 15, Pp 121-141 (2024)

مصطلحات موضوعية: Geology, QE1-996.5, Stratigraphy, QE640-699

وصف الملف: electronic resource

Relation: https://se.copernicus.org/articles/15/121/2024/se-15-121-2024.pdf; https://doaj.org/toc/1869-9510; https://doaj.org/toc/1869-9529

URL الوصول: https://doaj.org/article/b252cbca601647969bd0d38e6accea4f

المؤلفون: M. Marrone, D. Ferorelli, A. Stellacci, F. Vinci

المصدر: Forensic Science International: Reports, Vol 3, Iss , Pp 100189- (2021)

مصطلحات موضوعية: Drowning, Immersion sequences, Time of death, Pool, Autopsy, Criminal law and procedure, K5000-5582

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2665910721000207; https://doaj.org/toc/2665-9107

URL الوصول: https://doaj.org/article/b778808af3cf49a1b5dac4418b56c486

المؤلفون: L. Massaro, A. Corradetti, F. Vinci, S. Tavani, A. Iannace, M. Parente, S. Mazzoli

المصدر: Geofluids, Vol 2018 (2018)

مصطلحات موضوعية: Geology, QE1-996.5

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1468-8115; https://doaj.org/toc/1468-8123

URL الوصول: https://doaj.org/article/f91915d66fc944ca9a5e19e7e3d873cc

المؤلفون: Brison, M., Bensetti, M., de Lacerda, R., Santos, F. Vinci Dos, Taurand, C.

المصدر: 2017 IEEE/AIAA 36th Digital Avionics Systems Conference (DASC) Digital Avionics Systems Conference (DASC), 2017 IEEE/AIAA 36th. :1-4 Sep, 2017

Relation: 2017 IEEE/AIAA 36th Digital Avionics Systems Conference (DASC)

المؤلفون: Brison, M., Bensetti, M., De Lacerda, R., Santos, F. Vinci Dos, Taurand, C.

المصدر: 2017 IEEE International Symposium on Power Line Communications and its Applications (ISPLC) Power Line Communications and its Applications (ISPLC), 2017 IEEE International Symposium on. :1-6 2017

Relation: 2017 IEEE International Symposium on Power Line Communications and its Applications (ISPLC)

المؤلفون: Brenes, A., Juillard, J., dos Santos, F. Vinci

المصدر: 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on. :1-4 Apr, 2014

Relation: 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Brenes, A., Juillard, J., Bourgois, L., dos Santos, F. Vinci

المصدر: 2015 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2015 IEEE International Symposium on. :1318-1319 May, 2015

Relation: 2015 IEEE International Symposium on Circuits and Systems (ISCAS)

المؤلفون: Brenes, A., Juillard, J., Santos, F. Vinci Dos

المصدر: In Procedia Engineering 2016 168:941-945

المؤلفون: Brenes, A., Juillard, J., Santos, F. Vinci Dos, Bonnoit, A.

المصدر: In Procedia Engineering 2014 87:823-826

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