المؤلفون: Meulman, Edwin

المساهمون: University/Department: Universitat de Girona. Departament d'Enginyeria Mecànica i de la Construcció Industrial, University/Department: Universitat de Girona. Departament de Física

مرشدي الرسالة: Renart Canalias, Jordi, Carreras Blasco, Laura, Zurbitu González, Javier, Costa i Balanzat, Josep

المصدر: TDX (Tesis Doctorals en Xarxa)

مصطلحات موضوعية: Unió adhesiva, Unión adhesiva, Bonded joint, Creixement d’esquerdes per fluència, Crecimiento de grietas por fluencia, Creep crack growth, RWDC, Roller wedge driven creep, FEM, Finite element method, Superfície de fractura, Superficie de fractura, Fracture surface, Taxa d'alliberament d'energia constant, Tasa de liberación de energía constante, Constant energy release rate, Wedge driven test

وصف الملف: application/pdf

URL الوصول: http://hdl.handle.net/10803/689639

المؤلفون: Fahim, Abdullah, Zhang, Ryan, Mavinkurve, Amar, Shantaram, Sandeep, Adli, Ali Rezaie, Tanwongwan, Wiwat, Hauck, Torsten

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2062-2069 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Chen, Guan-Wei, Lin, Yan-Cheng, Hsu, Chung-Hsiang, Chen, Tang-Yuan, Wang, Chen-Chao, Hung, Chin-Pin, Wang, Hung-Kai

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1593-1598 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Bretthauer, Lars-Michel, Heynicke, Ralf, Scholl, Gerd

المصدر: 2024 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) Instrumentation and Measurement Technology Conference (I2MTC), 2024 IEEE International. :1-6 May, 2024

Relation: 2024 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

المؤلفون: Manzo, Rosanna, Arpaia, Pasquale, Balato, Marco, Cuneo, Davide, Mancino, Francesca, Minucci, Simone, Moccaldi, Nicola, Petrarca, Carlo

المصدر: 2024 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) Instrumentation and Measurement Technology Conference (I2MTC), 2024 IEEE International. :1-6 May, 2024

Relation: 2024 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

المؤلفون: Zrinej, Samiha, Nor-Eddine, Laghzale, Bouzid, Hakim A.

المصدر: 2024 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET) Innovative Research in Applied Science, Engineering and Technology (IRASET), 2024 4th International Conference on. :1-6 May, 2024

Relation: 2024 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET)

المؤلفون: Chater, Nezha, Mhaiti, Nissrine, Elfahime, Benaissa, Radouani, Mohammed

المصدر: 2024 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET) Innovative Research in Applied Science, Engineering and Technology (IRASET), 2024 4th International Conference on. :1-6 May, 2024

Relation: 2024 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET)

المؤلفون: Wang, Yiliu, Komatsu, Tomoya, Wu, Nan

المصدر: 2024 IEEE MTT-S International Conference on Microwave Acoustics & Mechanics (IC-MAM) Microwave Acoustics & Mechanics (IC-MAM), 2024 IEEE MTT-S International Conference on. :97-100 May, 2024

Relation: 2024 IEEE MTT-S International Conference on Microwave Acoustics & Mechanics (IC-MAM)

المؤلفون: Islam, Gazi Rabeya, Tasnim, Sharaf, Ahmed, Afridi

المصدر: 2024 6th International Conference on Electrical Engineering and Information & Communication Technology (ICEEICT) Electrical Engineering and Information & Communication Technology (ICEEICT), 2024 6th International Conference on. :248-253 May, 2024

Relation: 2024 6th International Conference on Electrical Engineering and Information & Communication Technology (ICEEICT)

المؤلفون: Shi, B., Su, M., Ma, R., Chen, C., You, X., Ding, F., Wang, Q., Cao, L.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(6):1036-1042 Jun, 2024