المؤلفون: Zhu, Tong, Lefeuvre, Elie, Herth, Etienne, Bouville, David, Brenes, Alexis

المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-5 Jun, 2024

Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Christen, T., Laihonen, S., Hillborg, H.

المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 31(4):1676-1684 Aug, 2024

المؤلفون: Shi, B., Su, M., Ma, R., Chen, C., You, X., Ding, F., Wang, Q., Cao, L.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(6):1036-1042 Jun, 2024

المؤلفون: Molles, Jack, Popovic, Zoya, Shukla, Prasoon, Peng, Shen

المصدر: 2024 IEEE Wireless and Microwave Technology Conference (WAMICON) Wireless and Microwave Technology Conference (WAMICON), 2024 IEEE. :1-4 Apr, 2024

Relation: 2024 IEEE Wireless and Microwave Technology Conference (WAMICON)

المؤلفون: Ratti, Andrea, Simoncini, Daniele, Adolfo, Annabel, Del Sarto, Marco, Gritti, Alex, Fedeli, Patrick, Maggi, Luca, Napolitano, Teresa, Shaw, Mark Andrew, Talledo, Jefferson

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-6 Sep, 2023

Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Santamargarita, D., Molinero, D., Bueno, E., Marron, M., Vasic, M.

المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 38(12):15818-15828 Dec, 2023

المؤلفون: Richert, D., Kaja, K., Moran-Meza, J. A., Gautier, B., Deleruyelle, D., Piquemal, F.

المصدر: 2023 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO) Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), 2023 IEEE MTT-S International Conference on. :133-135 Jun, 2023

Relation: 2023 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)

المؤلفون: Catalano, A.P., Scognamillo, C., Piccirillo, F., Iasiello, M., Guerriero, P., Bianco, N., Codecasa, L., d'Alessandro, V.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(8):1088-1095 Aug, 2023

المؤلفون: Heyn, W., Ananiev, S., Melzner, H., Goller, K., Zechner, J., Clausner, A., Zschech, E.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 23(1):80-88 Mar, 2023

المؤلفون: Ray, Anubhab, Sinha, Soumendu, Haque, Fozia Z.

المصدر: 2022 IEEE International Conference of Electron Devices Society Kolkata Chapter (EDKCON) Electron Devices Society Kolkata Chapter (EDKCON), 2022 IEEE International Conference of. :145-150 Nov, 2022

Relation: 2022 IEEE International Conference of Electron Devices Society Kolkata Chapter (EDKCON)