المؤلفون: Wu, Ernest, McGowan, Brian, Bolam, Ronald, Huang, Huai, Zhou, Huimei, Wang, Miaomiao

المصدر: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :1-9 Apr, 2024

Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Patidar, Savitanandan, Bodade, Rajesh M

المصدر: 2024 IEEE International Students' Conference on Electrical, Electronics and Computer Science (SCEECS) Electrical, Electronics and Computer Science (SCEECS), 2024 IEEE International Students' Conference on. :1-7 Feb, 2024

Relation: 2024 IEEE International Students' Conference on Electrical, Electronics and Computer Science (SCEECS)

المؤلفون: Kang, B., An, J., Park, J., Hong, G., Ham, B., Pyo, J., Ahn, S., Baek, R.

المصدر: IEEE Access Access, IEEE. 12:110273-110282 2024

المؤلفون: Zimmer, Thomas, Fregonese, Sebastien, Chakravorty, Anjan

المصدر: 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2023 IEEE. :44-49 Oct, 2023

Relation: 2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)

المؤلفون: Zhou, Huimei, Wang, Miaomiao, Wu, Ernest

المصدر: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :2A.1-1-2A.1-6 Apr, 2024

Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Lofrano, Melina, Oprins, Herman, Chang, Xinyue, Vermeersch, Bjorn, Pedreira, Olalla Varela, Lesniewska, Alicja, Cherman, Vladimir, Ciofi, Ivan, Croes, Kristof, Park, Seongho, Tokei, Zsolt

المصدر: 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-7 Mar, 2023

Relation: 2023 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Das, D., Ravindran, P.V., Park, C., Tasneem, N., Wang, Z., Chen, H., Chern, W., Yu, S., Datta, S., Khan, A.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 44(2):257-260 Feb, 2023

المؤلفون: Lofrano, Melina, Vermeersch, Bjorn, Oprins, Herman, Park, Seongho, Tokei, Zsolt

المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-9 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Chi, Min-Hwa^Aff5

المساهمون: Wang, Yangyuan, editor^Aff1, Chi, Min-Hwa, editor^Aff2, Lou, Jesse Jen-Chung, editor^Aff3, Chen, Chun-Zhang, editor^Aff4

المصدر: Handbook of Integrated Circuit Industry. :951-977

المؤلفون: Bu, Weihai^Aff5, Wang, Wenbo^Aff6

المساهمون: Wang, Yangyuan, editor^Aff1, Chi, Min-Hwa, editor^Aff2, Lou, Jesse Jen-Chung, editor^Aff3, Chen, Chun-Zhang, editor^Aff4

المصدر: Handbook of Integrated Circuit Industry. :863-870