يعرض 1 - 10 نتائج من 668,987 نتيجة بحث عن '"FINITE element method"', وقت الاستعلام: 1.11s تنقيح النتائج
  1. 1
    رسالة جامعية
    Analysis of creep crack growth in adhesively bonded joints under mode I loading

    المؤلفون: Meulman, Edwin

    المساهمون: University/Department: Universitat de Girona. Departament d'Enginyeria Mecànica i de la Construcció Industrial, University/Department: Universitat de Girona. Departament de Física

    مرشدي الرسالة: Renart Canalias, Jordi, Carreras Blasco, Laura, Zurbitu González, Javier, Costa i Balanzat, Josep

    المصدر: TDX (Tesis Doctorals en Xarxa)

    مصطلحات موضوعية: Unió adhesiva, Unión adhesiva, Bonded joint, Creixement d’esquerdes per fluència, Crecimiento de grietas por fluencia, Creep crack growth, RWDC, Roller wedge driven creep, FEM, Finite element method, Superfície de fractura, Superficie de fractura, Fracture surface, Taxa d'alliberament d'energia constant, Tasa de liberación de energía constante, Constant energy release rate, Wedge driven test

    وصف الملف: application/pdf

    URL الوصول: http://hdl.handle.net/10803/689639

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  2. 2
    مؤتمر
    Numerical methods for solving the linearized model of a hinged-free reduced plate arising in flow structure interactions

    المؤلفون: Dhara, Raj Narayan, Rutkowski, Krzysztof, Szulc, Katarzyna

    المصدر: 2024 28th International Conference on Methods and Models in Automation and Robotics (MMAR) Methods and Models in Automation and Robotics (MMAR), 2024 28th International Conference on. :585-590 Aug, 2024

    Relation: 2024 28th International Conference on Methods and Models in Automation and Robotics (MMAR)

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  3. 3
    مؤتمر
    Effect of Slope Terrain on the Ground Level Total Electric Field of HVDC Transmission Lines

    المؤلفون: Xu, Qihao, Xie, Li, Lu, Tiebing

    المصدر: 2024 IEEE International Conference on High Voltage Engineering and Applications (ICHVE) High Voltage Engineering and Applications (ICHVE), 2024 IEEE International Conference on. :1-4 Aug, 2024

    Relation: 2024 IEEE International Conference on High Voltage Engineering and Applications (ICHVE)

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  4. 4
    مؤتمر
    The Influence of Ocean Wave Fluctuations on The Electric Field Intensity of Offshore Floating Overhead Transmission Lines

    المؤلفون: Geng, Zehua, Gu, Miaosong, Bian, Xingming

    المصدر: 2024 IEEE International Conference on High Voltage Engineering and Applications (ICHVE) High Voltage Engineering and Applications (ICHVE), 2024 IEEE International Conference on. :1-4 Aug, 2024

    Relation: 2024 IEEE International Conference on High Voltage Engineering and Applications (ICHVE)

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  5. 5
    مؤتمر
    Numerical Simulation of Three-Dimensional Electric Field in a Prototype of 35kV Offshore Single-Point Mooring Device

    المؤلفون: Wu, Haihong, Zhang, Yucheng, Wu, Haiyan, Shuai, Gaopeng, Li, Wendong, Mu, Haibao

    المصدر: 2024 IEEE International Conference on High Voltage Engineering and Applications (ICHVE) High Voltage Engineering and Applications (ICHVE), 2024 IEEE International Conference on. :1-5 Aug, 2024

    Relation: 2024 IEEE International Conference on High Voltage Engineering and Applications (ICHVE)

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  6. 6
    مؤتمر
    Finite Element Analysis of Planar Inductors With Soft Magnetic Encapsulation Materials

    المؤلفون: Wang, Jiaxuan, Li, Xiao, Zhao, Jiayan, Li, Jinbing, Zhang, Guoqi, Liu, Pan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  7. 7
    مؤتمر
    An SEM-Based Finite Element Analysis of Cu-Ag Sintered Joints on Thermal Shock Reliability

    المؤلفون: Wang, Xinyue, Yang, Zhoudong, Ji, Liangzheng, Zeng, Zejun, Chen, Haixue, Fan, Jiajie, Zhang, Jing, Liu, Pan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  8. 8
    مؤتمر
    Reliability Analysis of 2.5D Package Structure Based on Thermal-Moisture-Mechanical Coupling

    المؤلفون: Dong, Hengzhi, Liu, Dongjing, Zhou, Junhao, Xie, Minghua, He, Fangxian, Yang, Daoguo

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  9. 9
    مؤتمر
    Numerical Modeling and Validation of Silicone-Type Receiving Layer for Micro-LED Laser-Based Mass Transfer

    المؤلفون: Li, Zehou, Ji, Liangzheng, Wang, Xin, Li, Zaihuan, Liu, Yang, Zhang, Jing

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  10. 10
    مؤتمر
    Effect of Redistributed Layer Metal Thermal Expansion on the Hybrid Bonding Surface Roughness

    المؤلفون: Zhao, Yunong, Zheng, Jialin, Wang, Zhuqiu, Sun, Niuyi, Yang, Dan, Mei, Na, Ouyang, Keqing

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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