المؤلفون: Torres Serra, Joel

المساهمون: University/Department: Universitat Politècnica de Catalunya. Departament d'Enginyeria Civil i Ambiental

مرشدي الرسالة: Rodríguez-Ferran, Antonio, Romero Morales, Enrique

المصدر: TDX (Tesis Doctorals en Xarxa)

مصطلحات موضوعية: Flowability, Granular column collapse, Particle image velocimetry, Bulk feeding, Cluster analysis, Discrete element method, Àrees temàtiques de la UPC::Enginyeria civil

وصف الملف: application/pdf

URL الوصول: http://hdl.handle.net/10803/671881

المؤلفون: Saini, Ayushi, Jan, Shumaila^{Aff1, IDs11694024028043_cor2}, Taneja, Neetu K., Oberoi, Harinder S., Chauhan, Komal^{Aff1, IDs11694024028043_cor5}

المصدر: Journal of Food Measurement and Characterization. :1-14

المؤلفون: Sharipzyanova, G. Kh., Eremeeva, Zh. V.^{Aff2, IDS2075113324700527_cor2}

المصدر: Inorganic Materials: Applied Research. 15(4):1004-1008

المؤلفون: Cacace, S.^{Aff1, IDs4096402300490z_cor1}, Boccadoro, M., Semeraro, Q.

المصدر: Progress in Additive Manufacturing. 9(4):889-904

المؤلفون: Kwon, Daeyul, Park, Seung-Kyu, Yoo, Youngjae^{Aff1, IDs00289024054192_cor3}

المصدر: Polymer Bulletin. :1-14

المؤلفون: Patra, Ch. Niranjan^{Aff1, IDs44174024002112_cor1}, Singha, Rakesh^{Aff2, IDs44174024002112_cor2}, Sahu, Kartikesh, Jena, Goutam Kumar, Das, Nihar Ranjan, Sruti, J.

المصدر: Biomedical Materials & Devices. :1-18

المؤلفون: Wang, Chao^{Aff1, Aff2, IDs122060240622y_cor1}, Xin, Houzhi^{Aff3, IDs122060240622y_cor2}, Luo, Dianyu, Fan, Hengliang^{Aff1, Aff2}, Yang, Hai^{Aff1, Aff2}, Wei, Tianlu^{Aff1, Aff2}, Li, Dasheng^{Aff1, Aff2}, Liu, Chunjing^{Aff1, Aff2, IDs122060240622y_cor8}

المصدر: Journal of Mechanical Science and Technology. 38(7):3477-3486

المؤلفون: Ando, Yasumasa^{Aff1, IDs11947023032436_cor1}, Watanabe, Takashi, Orikasa, Takahiro, Tomita, Satoru

المصدر: Food and Bioprocess Technology: An International Journal. 17(7):1958-1969

المؤلفون: Kamimura, Tsuyoshi, Shigeno, Yuto, Sato, Shinichi, Schmaltz, Brian

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1226-1230 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Aggarwal, Jaideep, Goyal, Shweta^{Aff1, IDs13369024092554_cor2}, Kumar, Maneek

المصدر: Arabian Journal for Science and Engineering. :1-29