يعرض 1 - 10 نتائج من 6,338 نتيجة بحث عن '"FO"', وقت الاستعلام: 1.40s تنقيح النتائج
  1. 1
    مؤتمر
    Transmission Line Designs on Glass-Embedded Fan Out Antenna in Packaging for 5G Applications

    المؤلفون: Liu, Yu-Chen, Lwo, Ben-Je, Chung, Tai-Chiang

    المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-4 Jun, 2024

    Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

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  2. 2
    دورية أكاديمية
    Adaptive Extended Kalman Filtering Based State-of-Charge and Voltage Estimation of a Lithium-Ion Battery Using a Fractional-Order Model

    المؤلفون: Guha, A., Routh, B., Prudhvi Velivela, N.

    المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(16):26225-26234 Aug, 2024

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  3. 3
    دورية أكاديمية
    Novel Complex Fractional Order Speed Controller for IM Drive Under Varying Operating Conditions With Enhanced Robustness

    المؤلفون: Adigintla, S., Aware, M.V., Bingi, K., Das, S.

    المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 71(8):8438-8447 Aug, 2024

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  4. 4
    دورية أكاديمية
    Reduced-Order Observer-Based Adaptive Fuzzy Self-Triggered Control for Fractional Order Nonlinear Systems Without Feasibility Conditions

    المؤلفون: Liu, H., Dong, H., Pan, Y.

    المصدر: IEEE Transactions on Systems, Man, and Cybernetics: Systems IEEE Trans. Syst. Man Cybern, Syst. Systems, Man, and Cybernetics: Systems, IEEE Transactions on. 54(7):4448-4460 Jul, 2024

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  5. 5
    دورية أكاديمية
    Improved Rotor Flux Observer With Disturbance Rejection for Sensorless SPMSM Control

    المؤلفون: Wu, X., Yang, D., Huang, S., Yu, X., Wu, T., Cui, H.

    المصدر: IEEE Transactions on Transportation Electrification IEEE Trans. Transp. Electrific. Transportation Electrification, IEEE Transactions on. 10(2):3603-3612 Jun, 2024

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  6. 6
    مؤتمر
    Advanced FO-PLP with Multi-chip for Wearable Application

    المؤلفون: Choi, Jooyoung, Kim, Hyungmin, Cho, Eun Seok, Oh, Gyunghwan, Ha, Seungsoo, Choi, Jaehoon, Park, Hwanpil, Lee, Seok Won, Kim, Dong Wook

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :7-10 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Fan-Out Embedded Bridge Structure for CoPackaged Optics Characterization and Evaluation

    المؤلفون: Lin, Vito, Shih, Teny, Kang, Andrew, Wang, Yu-Po

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1246-1250 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    Exploring Gear Optimization Using Firefly Algorithm

    المؤلفون: Jai Rajesh, P, Balambica, V., Achudhan, M.

    المصدر: 2024 4th International Conference on Advance Computing and Innovative Technologies in Engineering (ICACITE) Advance Computing and Innovative Technologies in Engineering (ICACITE), 2024 4th International Conference on. :1649-1655 May, 2024

    Relation: 2024 4th International Conference on Advance Computing and Innovative Technologies in Engineering (ICACITE)

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  9. 9
    مؤتمر
    Grace-Based Observations for Near Real-Time Assessment of Groundwater Drought Severity Index

    المؤلفون: Touati, Fatah, Benaraba, Nawel, Benyahia, Slimane

    المصدر: 2024 IEEE Mediterranean and Middle-East Geoscience and Remote Sensing Symposium (M2GARSS) Geoscience and Remote Sensing Symposium (M2GARSS), 2024 IEEE Mediterranean and Middle-East. :396-400 Apr, 2024

    Relation: 2024 IEEE Mediterranean and Middle-East Geoscience and Remote Sensing Symposium (M2GARSS)

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  10. 10
    مؤتمر
    Application of Digital Image Correlation (DIC) for deformation measurement of fan-out Wafer Level Package mounted on Printed Circuit Board

    المؤلفون: Maus, I., Niessner, M., Zhang, M., Hartner, W., Seiler, B., Altieri-Weimar, P.

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-6 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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