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1دورية أكاديمية
المؤلفون: Taylor, O., Gao, Y., Lakrimi, M., Evans, D., Garstka, T., Pan, Q., Weiss, K., Canfer, S., Wilbers, H., Martin, H., Havard, G.
المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 34(5):1-5 Aug, 2024
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2مؤتمر
المؤلفون: Lall, Pradeep, Pandurangan, Aathi Raja Ram, Choudhury, Padmanava, Kasturi, Madhu, Suhling, Jeff
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :142-149 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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3مؤتمر
المؤلفون: Chen, Bo-Shuo, Chiu, Tz-Cheng, Yin, Wei-Jie, Kao, Chin-Li, Hung, Chih-Pin
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :150-156 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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4رسالة جامعية
المؤلفون: Medina Escobar, Sergio Alonso
المساهمون: University/Department: Universitat de Girona. Departament d'Enginyeria Mecànica i de la Construcció Industrial
مرشدي الرسالة: Blanco Villaverde, Norbert, González Juan, Emilio Vicente
المصدر: TDX (Tesis Doctorals en Xarxa)
مصطلحات موضوعية: Materials compostos, Materiales compuestos, Composite materials, Tenacitat a la fractura, Tenacidad a la fractura, Fracture toughness, Efectes dinàmics, Efectos dinámicos, Dynamic effects, Alta velocitat de càrrega, Alta velocidad de carga, High loading rates, Delaminació, Delaminación, Delamination, mode I, Mètode d'assaig, Método de ensayo, Testing method
وصف الملف: application/pdf
URL الوصول: http://hdl.handle.net/10803/687869
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5مؤتمر
المؤلفون: Lee, Po-Yi, Chen, Kuo-Shen, Chiu, Tz-Cheng, Yang, Tian-Shiang, Ho, Ching-Jenq, Chen, Lien-Wen
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :285-286 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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6دورية أكاديمية
المؤلفون: Guo, Yangqin, Liu, Chang, Li, Xiangyu
المصدر: Journal of Applied Physics; 12/28/2023, Vol. 134 Issue 24, p1-10, 10p
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7دورية أكاديمية
المؤلفون: Huang, Yijing, Qin, Feng, Dai, Kaiqing, Chen, Shaohua, Li, Jiejie, Li, Jianjun
المصدر: Journal of Applied Physics; 12/21/2023, Vol. 134 Issue 23, p1-10, 10p
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8مؤتمر
المؤلفون: Yasar, Miray, Murphy, Neal, Ivankovic, Alojz
المصدر: 2023 IEEE International Symposium on Applications of Ferroelectrics (ISAF) Applications of Ferroelectrics (ISAF), 2023 IEEE International Symposium on. :1-4 Jul, 2023
Relation: 2023 IEEE International Symposium on Applications of Ferroelectrics (ISAF)
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9
المؤلفون: Grifé, Laura, Frómeta, David, Payà, Anna, Casellas, Daniel
المصدر: Material Forming - ESAFORM 2024 Materials Research Proceedings. :1206-1214
مصطلحات موضوعية: 3rd Gen Advanced High Strength Steels, Fracture Toughness, Pre-Deformation, Solid Mechanics, Hållfasthetslära
وصف الملف: electronic
URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-107766
https://doi.org/10.21741/9781644903131-134
https://ltu.diva-portal.org/smash/get/diva2:1875831/FULLTEXT01.pdf -
10
المؤلفون: Arya, Pradyumn Kumar, Jain, Neelesh Kumar, Sathiaraj, Dan, Patel, Vivek, 1983
المصدر: Journal of Materials Research and Technology. 28:3526-3540
مصطلحات موضوعية: 3D printing, Abrasion, Additives, Aluminum alloys, Binary alloys, Brittle fracture, Chromium alloys, Ductile fracture, Fracture toughness, High strength alloys, Microhardness, Military applications, Tensile strength, Ternary alloys, Textures, Vanadium alloys, Wear resistance, Additive manufacturing process, Alloy microstructure, Chromium contents, High-strength, Microstructure characteristics, Thermo-calc simulation, Thermocalc, Ti-6Al-4V alloy, Α-ti and β-ti phase, Μ-plasma powder additive manufacturing, Titanium alloys, Production Technology, Produktionsteknik
وصف الملف: print