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1مؤتمر
المؤلفون: Pang, J.H.L., Fa-Xing Che
المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :1011-1017 2006
Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems
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2مؤتمر
المؤلفون: Fa-Xing Che, Pang, J.H.L., Xu, L.H.
المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :1018-1023 2006
Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems
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3مؤتمر
المؤلفون: Fa-Xing Che, Pang, J.H.L., Lu-Hua Xu
المصدر: 2005 7th Electronic Packaging Technology Conference Electronics Packaging Technology Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th. 2:4 pp. 2005
Relation: Proceedings of 7th Electronics Packaging Technology Conference
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4مؤتمر
المؤلفون: Fa-Xing Che, Pang, H.L.J.
المصدر: 2005 7th Electronic Packaging Technology Conference Electronics Packaging Technology Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th. 2:5 pp. 2005
Relation: Proceedings of 7th Electronics Packaging Technology Conference
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5
المؤلفون: Koustav Sinha, Christopher Glancey, Wren Chen, Pluck Yang, Ling Pan, Fa Xing Che, Yeow Chon Ong, Hong Wan Ng
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::db1eb05402850d3f920032106a99eb15
https://doi.org/10.1109/eptc56328.2022.10013291 -
6
المؤلفون: Wren Chen, Pluck Yang, Koustav Sinha, Christopher Glancey, Ling Pan, Fa Xing Che, Yeow Chon Ong
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::98e88418de44d80c4dedc0658d47c11b
https://doi.org/10.1109/eptc56328.2022.10013130 -
7
المؤلفون: Fa Xing Che, Yeow Chon Ong, Ling Pan, Wei Yu, Hong Wan Ng
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d501d2052aaa2570914aedfd3c4ffe07
https://doi.org/10.1109/eptc56328.2022.10013290 -
8
المؤلفون: Ling Pan, Fa Xing Che, Yeow Chon Ong, Hong Wan Ng, Koustav Sinha, Wren Chen
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5412a8eab557efc125a684d36dfe148a
https://doi.org/10.1109/eptc56328.2022.10013204 -
9
المؤلفون: Kun Zhou, Kai Yang, Yujia Tian, Fa Xing Che, Facheng Zhao, Alfred Yeo
المصدر: MRS Communications. 11:917-923
مصطلحات موضوعية: Work (thermodynamics), Materials science, Testing protocols, business.industry, Indentation, Microelectronics, General Materials Science, Deformation (meteorology), Strain rate, Thin film, Composite material, business, Characterization (materials science)
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10
المؤلفون: Fa Xing Che, Yeow Chon Ong, Hong Wan Ng, Ling Pan, Christopher Glancey, Koustav Sinha, Richard Fan
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::236ce56025409208c1ca5860151f83cb
https://doi.org/10.1109/ectc51906.2022.00256
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