المؤلفون: Pfannenstiel, Hanna, Ungerer, Martin, Sieber, Ingo

المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-5 Jun, 2024

Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Schiavoni, Leandro, Liano, Lucas, Palumbo, Felix, Kasulin, Andres, Rus, Daniel, Garcia-Inza, Mariano

المصدر: 2024 Argentine Conference on Electronics (CAE) Electronics (CAE), 2024 Argentine Conference on. :75-79 Mar, 2024

Relation: 2024 Argentine Conference on Electronics (CAE)

المؤلفون: Zheng, Mengyao, Bao, Haifei, Wang, Jiachou, Li, Xinxin

المصدر: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2024 IEEE 37th International Conference on. :911-914 Jan, 2024

Relation: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Lin, Y., Wang, S., Tseng, Y., Lin, Z., Chen, J., Chang, C., Wang, G.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(2):1398-1404 Jan, 2024

المؤلفون: Livadaru, Leonard, Virlan, Bogdan, Munteanu, Adrian, Nacu, Ionut, Simion, Alecsandru, Nastas, Ion

المصدر: 2023 International Conference on Electromechanical and Energy Systems (SIELMEN) Electromechanical and Energy Systems (SIELMEN), 2023 International Conference on. :1-4 Oct, 2023

Relation: 2023 International Conference on Electromechanical and Energy Systems (SIELMEN)

المؤلفون: Galimberti, C., Gattere, G., Riani, M., Zega, V.

المصدر: IEEE Sensors Letters IEEE Sens. Lett. Sensors Letters, IEEE. 7(10):1-4 Oct, 2023

المؤلفون: Kothiyal, Suman Rani, Kumar Ratnesh, Ratneshwar, Kumar, Abhishek

المصدر: 2023 International Conference on Device Intelligence, Computing and Communication Technologies, (DICCT) Device Intelligence, Computing and Communication Technologies, (DICCT, 2023 International Conference on. :433-438 Mar, 2023

Relation: 2023 International Conference on Device Intelligence, Computing and Communication Technologies, (DICCT)

المؤلفون: Miyajima, S., Yamashita, T., Tanaka, M., Takeuchi, N., Inomata, K., Terai, H.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 33(5):1-4 Aug, 2023

المؤلفون: Olaya, D., Biesecker, J., Castellanos-Beltran, M., Sirois, A., Howe, L., Dresselhaus, P., Benz, S., Hopkins, P.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 33(5):1-5 Aug, 2023

المؤلفون: Sim, Sangjun, Bae, Kyubin, Kim, Jongbaeg

المصدر: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2023 IEEE 36th International Conference on. :724-727 Jan, 2023

Relation: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)