المؤلفون: Flauta, Randolph, Juergen-Funke, Hans, Birkoben, Tom, Habenict, Sonke, Liguda, Christian, Tai, King Man, Fan, Haibo, Yao, Peilun, Chen, Haibin

المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :1098-1102 Dec, 2023

Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Boettcher, Tim, Ilicali, Gurkan, Birkoben, Tom, Fan, Haibo, Haenze, Max, Sabelfeld, Alex, Kahl, Soenke

المصدر: 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2023 35th International Symposium on. :302-305 May, 2023

Relation: 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

المؤلفون: Zhou, Zhou, Fan, Haibo, Brown, Adam

المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023

Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Fan, Haibo, Yao, Peilun, Chen, Haibin

المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-5 Apr, 2023

Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Zhou, Qiping, Wei, Yong, He, Wei, Shang, Shu, Fan, Haibo, Yin, Weisong

المصدر: 2022 International Conference on Automation, Robotics and Computer Engineering (ICARCE) Automation, Robotics and Computer Engineering (ICARCE), 2022 International Conference on. :1-4 Dec, 2022

Relation: 2022 International Conference on Automation, Robotics and Computer Engineering (ICARCE)

المؤلفون: Yao, Peilun, Chen, Haibin, Fan, Haibo, Wu, Jingshen, Yang, Jinglei

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Zhou, Zhou, Fan, Haibo

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Fan, Haibo, Zhou, Zhou, Shi, Yuning, Shiu, Ivan, Yang, Jun, Chen, Haibin

المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-4 Apr, 2022

Relation: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Flauta, Randolph, Zhou, Zhou, Fan, Haibo, Chen, Haibin

المصدر: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2021 27th International Workshop on. :1-6 Sep, 2021

Relation: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

المؤلفون: Zhou, Zhou, Fan, Haibo, Shi, Yuning

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-6 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)