المؤلفون: Fan, Rong, Mo, Yongpeng, Fan, Shuwei, Jia, Shenli

المصدر: 2023 30th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV) Discharges and Electrical Insulation in Vacuum (ISDEIV), 2023 30th International Symposium on. :422-425 Jun, 2023

Relation: 2023 30th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)

المؤلفون: Wu, Zhaode, Su, Haibo, Liu, Junxiang, Mo, Yongpeng, Fan, Shuwei, Jia, Shenli

المصدر: 2023 30th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV) Discharges and Electrical Insulation in Vacuum (ISDEIV), 2023 30th International Symposium on. :410-413 Jun, 2023

Relation: 2023 30th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)

المؤلفون: Fan, Shuwei, Liu, Yao, Su, Juliang, Wu, Xianyou, Jiang, Qiong

المصدر: 2023 IEEE/ACM 23rd International Symposium on Cluster, Cloud and Internet Computing (CCGrid) CCGRID Cluster, Cloud and Internet Computing (CCGrid), 2023 IEEE/ACM 23rd International Symposium on. :605-614 May, 2023

Relation: 2023 IEEE/ACM 23rd International Symposium on Cluster, Cloud and Internet Computing (CCGrid)

المؤلفون: Cao, Ao^Aff12, Gao, Hongli^Aff12, Fan, Shuwei^Aff12, Liu, Yalei^Aff12

المساهمون: Chaari, Fakher, Series Editor^Aff1, Gherardini, Francesco, Series Editor^Aff2, Ivanov, Vitalii, Series Editor^Aff3, Haddar, Mohamed, Series Editor^Aff4, Cavas-Martínez, Francisco, Editorial Board Member^Aff5, di Mare, Francesca, Editorial Board Member^Aff6, Kwon, Young W., Editorial Board Member^Aff7, Trojanowska, Justyna, Editorial Board Member^Aff8, Xu, Jinyang, Editorial Board Member^Aff9, Rui, Xiaoting, editor^Aff10, Liu, Caishan, editor^Aff11

المصدر: Proceedings of the 2nd International Conference on Mechanical System Dynamics : ICMSD2023. :463-475

المؤلفون: Cui, Wei, Gao, Ze, Zhang, Zhen-An, Rao, Yufei, Tian, Chunsun, Fan, Shuwei

المصدر: 2021 4th International Conference on Energy, Electrical and Power Engineering (CEEPE) Energy, Electrical and Power Engineering (CEEPE), 2021 4th International Conference on. :1254-1258 Apr, 2021

Relation: 2021 4th International Conference on Energy, Electrical and Power Engineering (CEEPE)

المؤلفون: Wang, Kang, Hu, Wenbo, Wu, Shengli, Fan, Shuwei, Wang, Hong-Xing

المصدر: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :44-44 Oct, 2021

Relation: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

المؤلفون: Cao, Ao, Gao, Hongli, Fan, Shuwei, Guo, Liang, You, Zhichao, Lei, Yuncong, Sun, Yi, He, Jigang

المصدر: In Mechanical Systems and Signal Processing 1 January 2025 222

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المؤلفون: Zhang Minghui, Wang Wei, Wen Feng, Lin Fang, Chen Genqiang, Wang Fei, He Shi, Wang Yanfeng, Fan Shuwei, Bu Renan, Min Tai, Yu Cui, Wang Hongxing

المصدر: Functional Diamond, Vol 2, Iss 1, Pp 258-262 (2022)

مصطلحات موضوعية: hydrogen-terminated diamond, field effect transistor, germanium, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2694-1120

URL الوصول: https://doaj.org/article/0fe7f312b12e46c4a6bfc6f484fdd1b7

المؤلفون: Li, Qi, Wang, Juan, Chen, Genqiang, He, Shi, Zhang, Qianwen, Zhang, Shumiao, Wang, Ruozheng, Fan, Shuwei, Wang, Hong-Xing

المصدر: In Diamond & Related Materials April 2023 134