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1دورية أكاديمية
المؤلفون: Zhang, Y., Zhang, X., Lane, A.N., Fan, T.W., Liu, J.
المصدر: IEEE Journal of Biomedical and Health Informatics IEEE J. Biomed. Health Inform. Biomedical and Health Informatics, IEEE Journal of. 24(5):1528-1536 May, 2020
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2دورية أكاديمية
المؤلفون: Wang, Z.P., Fan, T.W., Lin, J.J., Liu, F., Liu, B., Fang, Q.H., Chen, D.C., Ma, L., Tang, P.Y.
المصدر: In Computational Materials Science March 2020 174
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3مؤتمر
المصدر: 1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105) Solid-state and integrated circuit technology Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on. :641-644 1998
Relation: Proceedings of Fifth International Conference on Solid-State and Integrated Circuit Technology-ICSICT'98
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4مؤتمر
المؤلفون: Lyu-Fan Zou, Wang, Z.G., Sun, D.Z., Fan, T.W., Liu, X.F., Zhang, J.W.
المصدر: Proceedings of Semiconducting and Semi-Insulating Materials Conference Semiconducting and insulating materials Semiconducting and Semi-Insulating Materials Conference, 1996. IEEE. :211-214 1996
Relation: Proceedings of Semiconducting and Semi-Insulating Materials Conference
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5مؤتمر
المؤلفون: Wu, J., Wang, Z.G., Zhang, M., Fan, T.W., Lin, L.Y.
المصدر: Proceedings of Semiconducting and Semi-Insulating Materials Conference Semiconducting and insulating materials Semiconducting and Semi-Insulating Materials Conference, 1996. IEEE. :349-352 1996
Relation: Proceedings of Semiconducting and Semi-Insulating Materials Conference
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6دورية أكاديمية
المؤلفون: Fan, T.W., Wang, Z.P., Lin, J.J., Chen, D.C., Fang, Q.H., Hu, T., Nie, B.H., Wang, K., Hu, H.W., Sun, H.B., He, H.Y., Ma, L., Tang, P.Y.
المصدر: In Journal of Alloys and Compounds 30 April 2019 783:765-771
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7دورية أكاديمية
المؤلفون: Yang, X.B., Chen, J.H., Zhang, G.H., Huang, L.P., Fan, T.W., Ding, Y., Yu, X.W.
المصدر: In Journal of Materials Science & Technology October 2018 34(10):1719-1729
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8دورية أكاديميةEffects of solute concentration on the stacking fault energy in copper alloys at finite temperatures
المؤلفون: Shao, Q.Q., Liu, L.H., Fan, T.W., Yuan, D.W., Chen, J.H.
المصدر: In Journal of Alloys and Compounds 5 December 2017 726:601-607
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9دورية أكاديمية
المؤلفون: Duan, S.Y., Wu, C.L., Gao, Z., Cha, L.M., Fan, T.W., Chen, J.H.
المصدر: In Acta Materialia 1 May 2017 129:352-360
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10دورية أكاديمية
المؤلفون: Tsai, Y.L., Wang, Li. H., Fan, T.W., Ranganath, Sam, Wang, C.K., Chou, C.P.
المصدر: In International Journal of Pressure Vessels and Piping 2010 87(1):26-32
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