المؤلفون: Kot, P., Wroński, M., Baczmański, A., Ludwik, A., Wroński, S., Wierzbanowski, K., Scheffzük, Ch., Pilch, J., Farkas, G.

مصطلحات موضوعية: Physics - Applied Physics, Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/2308.00663

المؤلفون: Ress, S., Sarkany, Z., Farkas, G., Rencz, M.

المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :399-404 Dec, 2021

Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

المؤلفون: Rencz, M., Poppe, A., Farkas, G.

المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :472-478 Dec, 2019

Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

المؤلفون: Farkas, G., Poppe, A., Gaal, L., Hantos, G., Bornoff, R., Rencz, M.

المصدر: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2019 25th International Workshop on. :1-8 Sep, 2019

Relation: 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

المؤلفون: Farkas, G., Gaal, L., Poppe, A., Rencz, M., Bornoff, R.

المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :954-960 Dec, 2018

Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Farkas, G., Poppe, A., Gaal, L., Hantos, G., Berenyi, Cs., Rencz, M.

المصدر: 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2018 24rd International Workshop on. :1-7 Sep, 2018

Relation: 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

المؤلفون: Farkas, G., Gaal, L., Bein, M., Poppe, A., Ress, S., Rencz, M.

المصدر: 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018 17th IEEE Intersociety Conference on. :262-270 May, 2018

Relation: 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Hantos, G., Hegedus, J., Bein, M. C., Gaal, L., Farkas, G., Sarkany, Z., Ress, S., Poppe, A., Rencz, M.

المصدر: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-7 Dec, 2017

Relation: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Tate, TP, Collins, P, Xu, Y, Yau, JC, Krishnan, J, Prado, Y, Farkas, G, Warschauer, M

المصدر: Scientific Studies of Reading. 23(4)

مصطلحات موضوعية: Pediatric, Clinical Research, Education, Psychology and Cognitive Sciences

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/4vw2g0m6

المؤلفون: Park, Y, Xu, Y, Collins, P, Farkas, G, Warschauer, M

المصدر: British Journal of Educational Technology. 50(4)

مصطلحات موضوعية: Pediatric, Basic Behavioral and Social Science, Behavioral and Social Science, Specialist Studies in Education, Education, Other Technology, Education Systems

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/6235t25b