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1دورية أكاديمية
المؤلفون: Berens, M., Mai, K., Feddeler, J., Pietri, S.
المصدر: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 66(11):1785-1789 Nov, 2019
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2مؤتمر
المؤلفون: Patnaik, A., Suchak, M., Seva, R., Pamidimukkala, K., Edgington, G., Moseley, R., Feddeler, J., Stockinger, M., Beetner, D.
المصدر: 2017 39th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2017 39th. :1-10 Sep, 2017
Relation: 2017 39th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)
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3مؤتمر
المؤلفون: Patnaik, A., Suchak, M., Seva, R., Pamidimukkala, K., Pommerenke, D., Edgington, G., Moseley, R., Feddeler, J., Stockinger, M., Beetner, D.
المصدر: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017 IEEE International Symposium on. :146-151 Aug, 2017
Relation: 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)
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4دورية أكاديمية
المؤلفون: Patnaik, A., Suchak, M., Seva, R., Pamidimukkala, K., Edgington, G., Moseley, R., Feddeler, J., Stockinger, M., Pommerenke, D., Beetner, D.G.
المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 60(4):1053-1060 Aug, 2018
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5مؤتمر
المؤلفون: Yater, Jane, Kang, S.-T., Hong, C. M., Min, B., Kolar, D., Loiko, K., Shen, J., Winstead, B., Gasquet, H., Mohammed, S., Hardell, A., Malloch, W., Cook, B., Syzdek, R., Jarrar, A., Feddeler, J., Baker, K., Chang, K.M., Herrin, S., Parks, R., Chindalore, G.
المصدر: 2012 IEEE International Conference on IC Design & Technology IC Design & Technology (ICICDT), 2012 IEEE International Conference on. :1-3 May, 2012
Relation: 2012 IEEE International Conference on IC Design & Technology (ICICDT)
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6دورية أكاديمية
المؤلفون: Wild, A., Quigley, J., Feddeler, J., Ledford, S., Caravella, J., Shapiro, F., Gilsdorf, B., Hong, M., Mietus, D., Davies, R.B., Parmar, R., Jy-Der Tai, Thomas, J., Quarberg, J., Hartung, E., Sawan, T., Carlquist, J.H., Papworth, K., Buxo, J., Schriber, M., Berens, M., Warren, D., Smith, B., Mazuelos, M., Bass, K., Layton, L.
المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 32(7):1049-1055 Jul, 1997
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7مؤتمر
المؤلفون: Secareanu, R., Hartin, O., Feddeler, J., Moseley, R., Shepherd, J., Vrignon, B., Jian Yang, Qiang Li, Hongwei Zhao, Li, W., Linpeng Wei, Salman, E., Wang, R., Blomberg, D., Parris, P.
المصدر: 2010 International SoC Design Conference (ISOCC); 2010, p21-24, 4p
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8مؤتمر
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