المؤلفون: Grasser, T., Feil, M., Waschneck, K., Reisinger, H., Berens, J., Waldhoer, D., Vasilev, A., Waltl, M., Aichinger, T., Bockstedte, M., Gustin, W., Pobegen, G.

المصدر: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :3B.1-1-3B.1-7 Apr, 2024

Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Winkler, TE, Feil, M, Stronkman, EFGJ, Matthiesen, I, Herland, A

المصدر: Lab on a chip. 20(7):1212-1226

مصطلحات موضوعية: Medicin och hälsovetenskap

URL الوصول: http://kipublications.ki.se/Default.aspx?queryparsed=id:143523835

المؤلفون: Salmen, P., Feil, M. W., Waschneck, K., Reisinger, H., Rescher, G., Aichinger, T.

المصدر: 2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-7 Mar, 2021

Relation: 2021 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Weger, M., Feil, M. W., Van Orden, M., Cottom, J., Bockstedte, M., Pobegen, G.

المصدر: Journal of Applied Physics; 7/21/2023, Vol. 134 Issue 3, p1-10, 10p

مصطلحات موضوعية: METAL oxide semiconductor field-effect transistors, FIELD-effect transistors, SILICON carbide, ELECTROLUMINESCENCE, PHOTON emission, LITERATURE reviews, CAPACITANCE measurement

المؤلفون: Drost, A., Klink, G., Feil, M., Bock, K.

المصدر: Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on. :130-135 2005

Relation: 2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

المؤلفون: Feil, M., Uhl, A.

المصدر: Proceedings 10th Euromicro Workshop on Parallel, Distributed and Network-based Processing Parallel, distributed and network-based processing Parallel, Distributed and Network-based Processing, 2002. Proceedings. 10th Euromicro Workshop on. :353-359 2002

Relation: Proceedings 10th Euromicro Workshop on Parallel, Distributed and Network-based Processing

المؤلفون: Konig, M., Klink, G., Feil, M.

المصدر: First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Polymers and adhesives in microelectronics and photonics Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on. :319-323 2001

Relation: First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings

المؤلفون: Feil, M., Kutil, R., Meerwald, P., Uhl, A.

المصدر: ISPA 2001. Proceedings of the 2nd International Symposium on Image and Signal Processing and Analysis. In conjunction with 23rd International Conference on Information Technology Interfaces (IEEE Cat. Image and signal processing and analysis Image and Signal Processing and Analysis, 2001. ISPA 2001. Proceedings of the 2nd International Symposium on. :24-35 2001

Relation: ISPA 2001. Proceedings of the 2nd International Symposium on Image and Signal Processing and Analysis

المؤلفون: Klink, G., Feil, M., Ansorge, F., Aschenbrenner, R., Reichl, H.

المصدر: 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Electronic components and technology Electronic Components and Technology Conference, 2001. Proceedings., 51st. :1034-1039 2001

Relation: 51st Electronic Components and Technology Conference 2001. Proceedings

المؤلفون: Aschenbrenner, Ansorge, F., Feil, M., Landesberger, C., Jung, E., Ostmann, A., Reichl, H.

المصدر: 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) Adhesive joining and coating technology in electronics manufacturing Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on. :16-19 2000

Relation: 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000