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1مؤتمر
المؤلفون: Atintoh, A., Kpobie, W., Bonfoh, N., Fendler, M., Lipinski, P.
المصدر: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021 22nd International Conference on. :1-5 Apr, 2021
Relation: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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2مؤتمر
المؤلفون: Zhai, Min, Ahmed Mohamed, Esam T., Locquet, Alexandre, Schneider, G., Kalmar, R., Fendler, M., Declercq, N. F., Citrin, D.S.
المصدر: 2021 46th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz) Infrared, Millimeter and Terahertz Waves (IRMMW-THz),2022 47th International Conference on. :1-2 Aug, 2021
Relation: 2021 46th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz)
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3مؤتمر
المؤلفون: Lebaudya, A.-L., Pescia, R., Kpobieb, W., Fendler, M.
المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :2060-2065 May, 2017
Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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4دورية أكاديمية
المؤلفون: Atintoh, A., Kpobie, W., Bonfoh, N., Fendler, M., Addiego, F., Lipinski, P.
المصدر: In Materials Today Communications March 2023 34
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5مؤتمر
المؤلفون: Kpobie, W., Bonfoh, N., Dreistadt, C., Fendler, M., Lipinski, P.
المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :2319-2325 May, 2013
Relation: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)
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6مؤتمر
المؤلفون: Kpobie, W., Bonfoh, N., Dreistadt, C., Fendler, M., Lipinski, P.
المصدر: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on. :1-6 Apr, 2013
Relation: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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7مؤتمر
المؤلفون: Tekaya, K., Fendler, M., Inal, K., Massoni, E., Ribot, H.
المصدر: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on. :1-7 Apr, 2013
Relation: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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8مؤتمر
المؤلفون: de Brugiere, B. Goubault, Marion, F., Fendler, M., Mandrillon, V., Hazotte, A., Volpert, M., Ribot, H.
المصدر: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :1400-1406 May, 2011
Relation: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
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9مؤتمر
المؤلفون: de Brugiere, B. Goubault, Marion, F., Fendler, M., Mandrillon, V., Hazotte, A., Volpert, M., Ribot, H.
المصدر: 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. :1757-1762 Jun, 2010
Relation: 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)
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10دورية أكاديمية
المؤلفون: Zhai, Min, Ahmed Mohamed, Esam T., Locquet, Alexandre, Schneider, G., Kalmar, R., Fendler, M., Declercq, N.F., Citrin, D.S.
المصدر: In NDT and E International September 2021 122