يعرض 1 - 10 نتائج من 147 نتيجة بحث عن '"Fendler, M."', وقت الاستعلام: 0.96s تنقيح النتائج
  1. 1
    مؤتمر
    Characterization of the mechanical behavior of a Printed Circuit Board (PCB)

    المؤلفون: Atintoh, A., Kpobie, W., Bonfoh, N., Fendler, M., Lipinski, P.

    المصدر: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021 22nd International Conference on. :1-5 Apr, 2021

    Relation: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  2. 2
    مؤتمر
    Diagnosis of injection-molded weld line in thermoplastic polymer by terahertz reflective imaging and scanning acoustic microscopy

    المؤلفون: Zhai, Min, Ahmed Mohamed, Esam T., Locquet, Alexandre, Schneider, G., Kalmar, R., Fendler, M., Declercq, N. F., Citrin, D.S.

    المصدر: 2021 46th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz) Infrared, Millimeter and Terahertz Waves (IRMMW-THz),2022 47th International Conference on. :1-2 Aug, 2021

    Relation: 2021 46th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz)

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  3. 3
    مؤتمر
    Local Stress Analysis by XRD Single Crystal Method and Kossel Diffraction Applied to a Flip Chip Structure

    المؤلفون: Lebaudya, A.-L., Pescia, R., Kpobieb, W., Fendler, M.

    المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :2060-2065 May, 2017

    Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

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  4. 4
    دورية أكاديمية
    Multiscale characterization of the mechanical behavior of a printed circuit board (PCB)

    المؤلفون: Atintoh, A., Kpobie, W., Bonfoh, N., Fendler, M., Addiego, F., Lipinski, P.

    المصدر: In Materials Today Communications March 2023 34

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  5. 5
    مؤتمر
    3D Modeling of high count fine pitch flip chip assemblies

    المؤلفون: Kpobie, W., Bonfoh, N., Dreistadt, C., Fendler, M., Lipinski, P.

    المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :2319-2325 May, 2013

    Relation: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    3D modeling of flip chip assemblies with large array and small pitch: validation of the proposed model

    المؤلفون: Kpobie, W., Bonfoh, N., Dreistadt, C., Fendler, M., Lipinski, P.

    المصدر: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on. :1-6 Apr, 2013

    Relation: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  7. 7
    مؤتمر
    Mechanical behavior of flexible silicon devices curved in spherical configurations

    المؤلفون: Tekaya, K., Fendler, M., Inal, K., Massoni, E., Ribot, H.

    المصدر: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on. :1-7 Apr, 2013

    Relation: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  8. 8
    مؤتمر
    A 10μm pitch interconnection technology using micro tube insertion into Al-Cu for 3D applications

    المؤلفون: de Brugiere, B. Goubault, Marion, F., Fendler, M., Mandrillon, V., Hazotte, A., Volpert, M., Ribot, H.

    المصدر: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :1400-1406 May, 2011

    Relation: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Micro tube insertion into indium, copper and other materials for 3D applications

    المؤلفون: de Brugiere, B. Goubault, Marion, F., Fendler, M., Mandrillon, V., Hazotte, A., Volpert, M., Ribot, H.

    المصدر: 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. :1757-1762 Jun, 2010

    Relation: 2010 IEEE 60th Electronic Components and Technology Conference (ECTC 2010)

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  10. 10
    دورية أكاديمية
    Diagnosis of injection-molded weld lines in ABS thermoplastic by polarized terahertz reflective imaging

    المؤلفون: Zhai, Min, Ahmed Mohamed, Esam T., Locquet, Alexandre, Schneider, G., Kalmar, R., Fendler, M., Declercq, N.F., Citrin, D.S.

    المصدر: In NDT and E International September 2021 122

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