المؤلفون: Kao, Frank, Zhi Hao Tseng, Chun Sheng Ho, Stan Chen, Chang-Yi Lan, Feng Lung Chien

المصدر: 2007 International Microsystems, Packaging, Assembly and Circuits Technology Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International. :323-326 Oct, 2007

Relation: 2007 International Microsystems, Packaging, Assembly and Circuits Technology

المؤلفون: Kuei Hsiao Kuo Frank, Shaun Xiao, Abram Hwang, Kui Chang, Jovi Chang, Feng Lung Chien

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::55ab404dcfe7cead90d3e7db1d66a891
https://doi.org/10.1109/ectc51906.2022.00272

المؤلفون: Joey Lin, Feng Lung Chien, Stan Chen, Yu Sheng Lin, Ting-en Lin, Kuei Hsiao Kuo Frank

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Materials science, chemistry, Semiconductor device modeling, chemistry.chemical_element, Wafer, Temperature cycling, Composite material, Copper, Layer (electronics), Curing (chemistry), Polyimide, Planarity testing

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::80637bf641ae3ac2a6fdbae32ea3bdd5
https://doi.org/10.1109/ectc32696.2021.00158

المؤلفون: Chen Kuang Hsin, Chun Yi Chiang, Feng Lung Chien, Ting-en Lin, Kuei Hsiao Kuo Frank, Stan Chen

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Materials science, Flexural strength, Passivation, Silicon, chemistry, Three point flexural test, Ball size, Ball (bearing), chemistry.chemical_element, Wafer, Fracture mechanics, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f0f7e9597b87cbff5c4e9d715bd546a5
https://doi.org/10.1109/ectc32862.2020.00328

المؤلفون: Rick Lee, Yen Neng Wang, Jiunn Jie Wang, Kuei Hsiao Kuo, Feng Lung Chien

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Materials science, Reliability (semiconductor), Soldering, Process (computing), Pillar, Temperature cycling, Composite material, Chip, Die (integrated circuit), High temperature storage

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::28361b8231d11fb0dbeeb3857199b0fe
https://doi.org/10.1109/ectc.2019.00251

المؤلفون: Chieh-Lung Lai, Gu-Yan Lin, Yih-Sin Chen, Feng-Lung Chien, Tz-Yuan Chao

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Materials science, Passivation, Chip-scale package, Ball grid array, Ball (bearing), Fan-out, Redistribution layer, Temperature cycling, Composite material, Drop test

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ea35b37a8dc8f135c1c74cbe338e00bd
https://doi.org/10.1109/ectc.2019.00181

المؤلفون: Rick Lee, Yen Neng Wang, Feng Lung Chien, Jiunn Jie Wang, Kuei Hsiao Kuo, Austin Chen, Jovi Chang

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Materials science, chemistry.chemical_element, Fine pitch, Epoxy, Copper, Cycle time, chemistry, visual_art, Soldering, Increased stress, visual_art.visual_art_medium, Wafer, Composite material, Polyimide

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c67efd561f373f8c339023a269285576
https://doi.org/10.1109/ectc.2018.00119

المؤلفون: Chui Feng Weng, Yi Sin Ting, Carolyn Ho, Rick Lee, Katch Wan, Feng Lung Chien, Kuei Hsiao Kuo

المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Engineering, business.industry, Soldering, Ball (bearing), Electronic engineering, Bumping, Wafer, Temperature cycling, Composite material, Electroplating, business, Drop test, Stress concentration

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c9e171caf5c6abc8502f2d27c2683d12
https://doi.org/10.1109/ectc.2017.29

المؤلفون: Kui Chang, Kuei Hsiao Kuo, Feng Lung Chien, Rick Lee, Jack Shu, Jerry Chiang, Katch Wang

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: 010302 applied physics, Materials science, Passivation, 020208 electrical & electronic engineering, Alloy, 02 engineering and technology, Temperature cycling, engineering.material, 01 natural sciences, Drop test, Soldering, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, engineering, Electronic engineering, Ball (bearing), Bumping, Wafer, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2a112a180ba1d90c0110bc705ca7acea
https://doi.org/10.1109/ectc.2016.17

المؤلفون: Kuei Hsiao Kuo, Jason Lee, Cindy Mao, Rick Lee, Katch Wang, Feng Lung Chien

المصدر: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

مصطلحات موضوعية: Substrate (building), Materials science, Organic solderability preservative, Soldering, Metallurgy, Pillar, Fine pitch, Electromigration, Current density, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::98b430efbb8f7bec3b04e82841e7db91
https://doi.org/10.1109/ectc.2015.7159657