يعرض 1 - 10 نتائج من 191 نتيجة بحث عن '"Fritzsch, T."', وقت الاستعلام: 1.17s تنقيح النتائج
  1. 1
    مؤتمر

    المصدر: 2019 12th German Microwave Conference (GeMiC) Microwave Conference (GeMiC), 2019 12th German. :178-181 Mar, 2019

    Relation: 2019 12th German Microwave Conference (GeMiC)

  2. 2
    مؤتمر

    المصدر: 2017 47th European Microwave Conference (EuMC) European Microwave Conference (EuMC), 2017 47th. :835-838 Oct, 2017

    Relation: 2017 47th European Microwave Conference (EuMC)

  3. 3
    دورية أكاديمية

    المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 67(5):1892-1900 May, 2019

  4. 4
    تقرير

    المؤلفون: Hoffman, A. C. Abusleme, Parès, G., Fritzsch, T., Rothermund, M., Jansen, H., Krüger, K., Sefkow, F., Velyka, A., Schwandt, J., Perić, I., Emberger, L., Graf, C., Macchiolo, A., Simon, F., Szalay, M., van der Kolk, N., Abramowicz, H., Benhammou, Y., Borysov, O., Borysova, M., Joffe, A., Kananov, S., Levy, A., Levy, I., Eigen, G., Bugiel, R., Bugiel, S., Firlej, M., Fiutowski, T. A., Idzik, M., Moroń, J., Świentek, K. P., Terlecki, P., de Renstrom, P. Brückman, Turbiarz, B., Wojtoń, T., Zawiejski, L. K., Firu, E., Ghenescu, V., Neagu, A. T., Preda, T., Boyko, I., Nefedov, Yu., Rymbekova, A., Sapronov, A., Shelkov, G., Zhemchugov, A., Ruiz-Jimeno, A., Vila, I., Fullana, E., Fuster, J., Lopez, P. Gomis, Perelló, M., Villarejo, M. A., Vos, M., Alozy, J., Tehrani, N. Alipour, Arominski, D., Sune, R. Ballabriga, Boyer, F., Brondolin, E., Buckland, M., Campbell, M., Dannheim, D., Dette, K., Ramos, F. Duarte, Plaja, N. Egidos, Elsener, K., Fiergolski, A., Rojas, C. Fuentes, Grefe, C., Hynds, D., Klempt, W., Kremastiotis, I., Kröger, J., Kulis, S., Leogrande, E., Linssen, L., Cudie, X. Llopart, Lucaci-Timoce, A., Munker, M., Musa, L., Nürnberg, A., Nuiry, F. -X., Codina, E. Perez, Pernegger, H., Petrič, M., Pitters, F., Quast, T., Redford, S., Riedler, P., Roloff, P., Sailer, A., Santin, E., Schnoor, U., Sicking, E., Sielewicz, K., Simoniello, R., Snoeys, W., Spannagel, S., Sroka, S., Ström, R., Valerio, P., van Dam, S., van der Kraaij, E., Vǎnát, T., Viazlo, O., Pinto, M. Vicente Barreto, Weber, M. A., Williams, M., Wolters, K., Benoit, M., Iacobucci, G., Sultan, D M S, Bosley, R. R., Price, T., Watson, M. F., Watson, N. K., Winter, A. G., Goldstein, J., Green, S., Marshall, J. S., Thomson, M. A., Xu, B., Casse, G., Vossebeld, J., Coates, T., Salvatore, F., Repond, J., Xia, L., Kenney, C., Tomada, A.

    مصطلحات موضوعية: Physics - Instrumentation and Detectors

  5. 5
    مؤتمر

    المصدر: 2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :1054-1061 May, 2012

    Relation: 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

  6. 6
    دورية أكاديمية

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 1(3):359-366 Mar, 2011

  7. 7
    مؤتمر

    المؤلفون: Berek, H., Tiederle, V., Fritzsch, T.

    المصدر: Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) Electronic manufacturing technology. IEMT-Europe Electronics Manufacturing Technology Symposium, 1998. IEMT-Europe 1998. Twenty-Second IEEE/CPMT International. :143-146 1998

    Relation: Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe. Electronics Manufacturing and Development for Automotives

  8. 8
    دورية أكاديمية

    المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 30(3):359-368 Aug, 2007

  9. 9
    مؤتمر

    المصدر: 2009 IEEE International Conference on 3D System Integration 3D System Integration, 2009. 3DIC 2009. IEEE International Conference on. :1-8 Sep, 2009

    Relation: 2009 IEEE International Conference on 3D System Integration (3DIC)

  10. 10
    مؤتمر

    المصدر: 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on. :86-91 Apr, 2009

    Relation: 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (MEMS/MOEMS)