المؤلفون: Kachi, Keisuke, Iwahori, Yuji, Usami, Hiroyasu, Fukui, Shinji, Wang, Aili, Bhuyan, M. K.

المصدر: 2020 9th International Congress on Advanced Applied Informatics (IIAI-AAI) IIAI-AAI Advanced Applied Informatics (IIAI-AAI), 2020 9th International Congress on. :463-466 Sep, 2020

Relation: 2020 9th International Congress on Advanced Applied Informatics (IIAI-AAI)

المؤلفون: Ando, Ren, Iwahori, Yuji, Fukui, Shinji, Wang, Aili, Bhuyan, M. K., Iwamoto, Takashi, Ueda, Jun

المصدر: 2020 9th International Congress on Advanced Applied Informatics (IIAI-AAI) IIAI-AAI Advanced Applied Informatics (IIAI-AAI), 2020 9th International Congress on. :467-470 Sep, 2020

Relation: 2020 9th International Congress on Advanced Applied Informatics (IIAI-AAI)

المؤلفون: Maeda, Noboru, Fukui, Shinji, Sekine, Toshikazu, Takahashi, Yasuhiro

المصدر: 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), 2019 IEEE International Symposium on. :223-228 Jul, 2019

Relation: 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)

المؤلفون: Furuta, Shotaro, Nakamura, Tsuyoshi, Iwahori, Yuji, Fukui, Shinji, Kanoh, Masayoshi, Yamada, Koji

المصدر: 2018 Joint 10th International Conference on Soft Computing and Intelligent Systems (SCIS) and 19th International Symposium on Advanced Intelligent Systems (ISIS) Soft Computing and Intelligent Systems (SCIS) and 19th International Symposium on Advanced Intelligent Systems (ISIS), 2018 Joint 10th International Conference on. :67-72 Dec, 2018

Relation: 2018 Joint 10th International Conference on Soft Computing and Intelligent Systems (SCIS) and 19th International Symposium on Advanced Intelligent Systems (ISIS)

المؤلفون: Furuta, Shotaro, Nakamura, Tsuyoshi, Iwahori, Yuji, Fukui, Shinji, Kanoh, Masayoshi, Yamada, Koji

المصدر: 2018 Conference on Technologies and Applications of Artificial Intelligence (TAAI) TAAI Technologies and Applications of Artificial Intelligence (TAAI), 2018 Conference on. :102-105 Nov, 2018

Relation: 2018 Conference on Technologies and Applications of Artificial Intelligence (TAAI)

المؤلفون: Fukui, Shinji, Maeda, Noboru, Xiao, Fengchao, Kami, Yoshio

المصدر: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), 2018 IEEE International Symposium on. :331-335 May, 2018

Relation: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC)

المؤلفون: Kojima, Yuya, Sekine, Toshikazu, Takahashi, Yasuhiro, Maeda, Noboru, Fukui, Shinji, Ishikawa, Yasuyuki

المصدر: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), 2018 IEEE International Symposium on. :713-717 May, 2018

Relation: 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC)

المؤلفون: Kudo, Hoshito, Tanaka, Satoshi, Yoshida, Yukihiro, Nakamura, Tsuyoshi, Kanoh, Masayoshi, Yamada, Koji, Oiwa, Daimu, Iwahori, Yuji, Fukui, Shinji

المصدر: 2017 Joint 17th World Congress of International Fuzzy Systems Association and 9th International Conference on Soft Computing and Intelligent Systems (IFSA-SCIS) Fuzzy Systems Association and 9th International Conference on Soft Computing and Intelligent Systems (IFSA-SCIS), 2017 Joint 17th World Congress of International. :1-5 Jun, 2017

Relation: 2017 Joint 17th World Congress of International Fuzzy Systems Association and 9th International Conference on Soft Computing and Intelligent Systems (IFSA-SCIS)

المؤلفون: Maeda, Noboru, Fukui, Shinji, Sekine, Toshikazu, Takahashi, Yasuhiro

المصدر: 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2017 IEEE 26th Conference on. :1-3 Oct, 2017

Relation: 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

المؤلفون: Maeda, Noboru, Fukui, Shinji, Sekine, Toshikazu, Takahashi, Yasuhiro

المصدر: 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) Electromagnetic Compatibility (EMC), 2016 IEEE International Symposium on. :108-113 Jul, 2016

Relation: 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016