-
1
المؤلفون: Alain Vincent, G. Dudragne, Joel Courbon, G. Lormand, P. Daguier
المصدر: Tribology International. 36:921-928
مصطلحات موضوعية: Materials science, Bearing (mechanical), business.industry, Mechanical Engineering, Surfaces and Interfaces, Structural engineering, Upper and lower bounds, Fatigue limit, Surfaces, Coatings and Films, law.invention, Stress field, chemistry.chemical_compound, chemistry, Stringer, Mechanics of Materials, law, Non-metallic inclusions, Inclusion (mineral), Composite material, business, Anisotropy
-
2
المؤلفون: Daniel Nelias, Alain Vincent, Daniel Girodin, G. Lormand, Christophe Jacq
المساهمون: Matériaux, ingénierie et science [Villeurbanne] (MATEIS), Université Claude Bernard Lyon 1 (UCBL), Université de Lyon-Université de Lyon-Institut National des Sciences Appliquées de Lyon (INSA Lyon), Institut National des Sciences Appliquées (INSA)-Université de Lyon-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS), Colin, Anne-Marie, Laboratoire de Mécanique des Contacts et des Structures [Villeurbanne] (LaMCoS), Institut National des Sciences Appliquées de Lyon (INSA Lyon), Institut National des Sciences Appliquées (INSA)-Université de Lyon-Institut National des Sciences Appliquées (INSA)-Université de Lyon-Centre National de la Recherche Scientifique (CNRS), Mateis, Laboratoire
المصدر: Materials Science and Engineering
Materials Science and Engineering, Elsevier, 2003, pp.311-319
Materials Science and Engineering: A
Materials Science and Engineering: A, Elsevier, 2003, pp.311-319مصطلحات موضوعية: Measurement point, Materials science, Mechanical Engineering, Metallurgy, 02 engineering and technology, [SPI.MAT] Engineering Sciences [physics]/Materials, Nanoindentation, 021001 nanoscience & nanotechnology, Condensed Matter Physics, [SPI.MAT]Engineering Sciences [physics]/Materials, 020303 mechanical engineering & transports, 0203 mechanical engineering, Mechanics of Materials, Residual stress, Stress profile, General Materials Science, Composite material, 0210 nano-technology, Material properties, ComputingMilieux_MISCELLANEOUS, Nitriding
-
3
المؤلفون: Roger Fougères, G. Lormand, C. Verdu, S. Carabajar
المصدر: Materials Science and Engineering: A. :544-549
مصطلحات موضوعية: Materials science, business.industry, Mechanical Engineering, Linear elasticity, technology, industry, and agriculture, Fractography, Fracture mechanics, Structural engineering, Paris' law, Condensed Matter Physics, Crack growth resistance curve, Finite element method, Crack closure, Mechanics of Materials, Powder metallurgy, mental disorders, General Materials Science, Composite material, business
-
4
المؤلفون: D. Girodin, A. Vincent, A. Hamel, G. Lormand, H. El Ghazal
المصدر: Matériaux & Techniques. 89:29-35
مصطلحات موضوعية: General Materials Science
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::61a2c04d7770ba33d4a8b99eee2ad929
https://doi.org/10.1051/mattech/200189010029 -
5Characterization of internal damage in a MMCp using X-ray synchrotron phase contrast microtomography
المؤلفون: Peter Cloetens, Eric Maire, Roger Fougères, G. Lormand, Jean-Yves Buffiere
المصدر: Acta Materialia. 47:1613-1625
مصطلحات موضوعية: Materials science, Polymers and Plastics, Alloy, Metals and Alloys, Elastic energy, Fracture mechanics, engineering.material, Finite element method, Synchrotron, Electronic, Optical and Magnetic Materials, law.invention, Cracking, stomatognathic system, law, Ceramics and Composites, engineering, Tomography, Growth rate, Composite material
-
6
المؤلفون: G. Lormand, P. Franciosi, R. Fougeres
المصدر: International Journal of Plasticity. 14:1013-1032
مصطلحات موضوعية: Yield (engineering), Materials science, Discretization, business.industry, Mechanical Engineering, Shell (structure), Mechanics, Structural engineering, Plasticity, Mechanics of Materials, General Materials Science, SPHERES, Microplasticity, Relaxation (approximation), Dislocation, business
-
7
المؤلفون: C. Rinaldi, George C Patton, Roger Fougères, Yves Bréchet, G. Lormand
المصدر: Materials Science and Engineering: A. 254:207-218
مصطلحات موضوعية: Coalescence (physics), Materials science, Mechanical Engineering, Metallurgy, Linear elasticity, chemistry.chemical_element, Intergranular corrosion, Condensed Matter Physics, Crack closure, chemistry, Mechanics of Materials, Aluminium, Fracture (geology), General Materials Science, Texture (crystalline), Composite material, Stress concentration
-
8
المؤلفون: G Lormand, G. Tartavel, Lucile Arnaud, P. Waltz
المصدر: Microelectronics Reliability. 38:1531-1537
مصطلحات موضوعية: Condensed matter physics, Scanning electron microscope, Chemistry, business.industry, Electrical engineering, Pulsed DC, Activation energy, Condensed Matter Physics, Electromigration, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Duty cycle, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Joule heating, Current density, Hillock
-
9
المؤلفون: Roger Fougères, G. Dudragne, Daniel Girodin, P. Lamagnere, F. Vergne, G. Lormand, Alain Vincent
المصدر: Journal of Tribology. 120:421-426
مصطلحات موضوعية: Engineering, Bearing (mechanical), business.industry, Mechanical Engineering, Surfaces and Interfaces, Structural engineering, Fatigue limit, Surfaces, Coatings and Films, law.invention, Stress (mechanics), Matrix (mathematics), Mechanics of Materials, law, Martensite, Shear stress, Load rating, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2132fc2f37ce2f4f198cd1e4d27af7ed
https://doi.org/10.1115/1.2834565 -
10
المؤلفون: G. Lormand, Lucile Arnaud, G. Tartavel, P. Waltz
المصدر: Microelectronics Reliability. 38:1041-1046
مصطلحات موضوعية: Materials science, Condensed matter physics, Analytical chemistry, Pulsed DC, Single level, Condensed Matter Physics, Electromigration, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Resist, Duty cycle, Thermal, Average current, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Current density