المؤلفون: Cheemalamarri, Hemanth Kumar, Sundaram, Arvind, Van Nhat Anh, Tran, Jae Ok, Yoo, Rao, Vempati Srinivasa, Singh, Navab

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1543-1547 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Lin, T.K., Chang, H.W., Chen, P.H., Wang, C.R., Wei, D.H., Tu, C.S., Chen, P.Y.

المصدر: IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 59(11):1-5 Nov, 2023

المؤلفون: Clara T. H. Tran, Aaron D. Gilmour, Badwi B. Boumelhem, Stuart T. Fraser, Marcela M. M. Bilek

المصدر: Small Science, Vol 4, Iss 4, Pp n/a-n/a (2024)

مصطلحات موضوعية: cell cultures, covalent attachment, glass substrates, plasma‐activated coating, stem cells, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2688-4046

URL الوصول: https://doaj.org/article/cc7507b48bfc4ed48c82a95f59c1e79a

المؤلفون: Bowrothu, Renuka, Kim, Haein, Yoon, Yong Kyu, Schmidt, Stephan

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :95-100 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Mirea, Teona, Olivares, Jimena, Clement, Marta, Sangrador, Jesus, Iborra, Enrique

المصدر: 2018 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2018 IEEE International. :1-4 Oct, 2018

Relation: 2018 IEEE International Ultrasonics Symposium (IUS)

المؤلفون: Popanda, Barbara^Aff3, Środa, Marcin^Aff3

المساهمون: Ikhmayies, Shadia Jamil, Series Editor^{Aff1, Aff2}

المصدر: Advances in Glass Research. :319-379

المؤلفون: Watanabe, Atom O., Lin, Tong-Hong, Ogawa, Tomonori, Raj, P. Markondeya, Sundaram, Venkatesh, Tentzeris, Manos M., Tummala, Rao R.

المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :180-183 Apr, 2018

Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

المؤلفون: Ballipinar, Faruk, Rastogi, Alok C., Garner, Sean M., Darling, Seth B.

المصدر: 2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC) Photovoltaic Specialists Conference (PVSC), 2016 IEEE 43rd. :1611-1616 Jun, 2016

Relation: 2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC)

المؤلفون: Gandhi, S., Pulugurtha, M.R., Sharma, H., Chakraborti, P., Tummala, R.R.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 6(10):1561-1566 Oct, 2016

المؤلفون: Wilbur, S., Anastopoulos, C., Angelmahr, M., Asfis, G., Koch, J., Lindblom, Magnus, Lohwasser, K., Margulis, Walter

المصدر: Journal of Instrumentation. 17(10)

مصطلحات موضوعية: Inspection with gamma rays, Inspection with X-rays, Scintillators, scintillation and light emission processes (solid, gas and liquid scintillators), X-ray detectors, Gamma rays, Glass, Glass substrates, Ionization, Optical fibers, Particle beams, Scintillation counters, X ray detectors, Early designs, Emission process, Gamma-rays, Inspection with gamma ray, Inspection with X-ray, Liquid scintillator, Scintillating fiber, Scintillator, scintillation and light emission process (solid, gas and liquid scintillator), X-ray detector, X-ray imaging detector, Scintillation

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-61396
https://doi.org/10.1088/1748-0221/17/10/C10013