المؤلفون: Ng, P. T., Rivai, F., Quah, A. C. T., Alag, J. C., Tan, P. K., Chen, C. Q.

المصدر: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-6 Jul, 2022

Relation: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Babu Killana, Kalyan, Devi Killana, Rama

المصدر: 2022 International Conference on Breakthrough in Heuristics And Reciprocation of Advanced Technologies (BHARAT) BHARAT Breakthrough in Heuristics And Reciprocation of Advanced Technologies (BHARAT), 2022 International Conference on. :1-4 Apr, 2022

Relation: 2022 International Conference on Breakthrough in Heuristics And Reciprocation of Advanced Technologies (BHARAT)

المؤلفون: Chopda, Bhushan N, Kaushik, Yashwardhan, Manchanda, Mayank, Jain, Sarthak, Randhawa, Princy, Mohammad, Gouse Baug

المصدر: 2022 First International Conference on Artificial Intelligence Trends and Pattern Recognition (ICAITPR) Artificial Intelligence Trends and Pattern Recognition (ICAITPR), 2022 First International Conference on. :1-6 Mar, 2022

Relation: 2022 First International Conference on Artificial Intelligence Trends and Pattern Recognition (ICAITPR)

المؤلفون: Parisi, Carlo^Aff6, Budorin, Dmitriy^Aff6

المساهمون: Huang, Ken, editor^Aff1, Parisi, Carlo, editor^Aff2, Tan, Lisa JY, editor^Aff3, Ma, Winston, editor^Aff4, Zhang, Zhijun William, editor^Aff5

المصدر: Web3 Applications Security and New Security Landscape : Theories and Practices. :55-71

المؤلفون: Srivastava, Sachin, Thakur, Amit Kumar^{Aff1, IDs4240502300636x_cor2}, Gupta, Lovi Raj, Singh, Rajesh

المصدر: International Journal of Aeronautical and Space Sciences. 25(1):146-153

المؤلفون: Yun, N., Sung, W.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(7):3826-3832 Jul, 2022

المؤلفون: Berens, Judith, Aichinger, Thomas

المصدر: 2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-5 Mar, 2021

Relation: 2021 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Jones, Anne C.^{Aff1, IDs10886023014403_cor1}, Lin, Po-An, Peiffer, Michelle, Felton, Gary

المصدر: Journal of Chemical Ecology. 49(9-10):518-527

المؤلفون: Hoàng Thị Thu, Đặng Minh Nhật, Nguyễn Hoàng Dũng

المصدر: Tạp chí Khoa học và Công nghệ, Pp 72-76 (2024)

مصطلحات موضوعية: frozen dough, hedonic test, gox, hpmc, datem, trehalose, Technology

وصف الملف: electronic resource

Relation: https://jst-ud.vn/jst-ud/article/view/8989; https://doaj.org/toc/1859-1531

URL الوصول: https://doaj.org/article/ae28e249f49044dba247368b8eb69f03

المؤلفون: Zhu, Qin, Liang, Yitao, Ji, Lin, Cai, Yu, Ren, Hangxu, Fang, Lu, Liang, Xiao, Ye, Xuesong, Liang, Bo

المصدر: 2019 IEEE SENSORS SENSORS, 2019 IEEE. :1-4 Oct, 2019

Relation: 2019 IEEE SENSORS